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TQP887052

TriQuint Semiconductor

WLAN Front End Module

Applications • IEEE 802.11ac, 802.11n WLAN Applications • Single-Chip RF Front-end Module • Wireless LAN Systems • Porta...


TriQuint Semiconductor

TQP887052

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Description
Applications IEEE 802.11ac, 802.11n WLAN Applications Single-Chip RF Front-end Module Wireless LAN Systems Portable Battery-Powered Equipment TQP887052 802.11ac, 802.11n WLAN Front End Module TQP887052 16 pin, 2.5x2.5 mm QFN package Product Features Fully Integrated, 802.11ac front-end module Internally matched input/output Temperature Compensated Bias Network Single battery voltage of 3.0V- 4.2V Leadless 2.5 x 2.5 x 0.40 mm SMT Pb-Free Typ. EVM = -37dB, 256QAM/MCS9 802.11ac Typ. Pout = 15.5dBm, 256QAM/MCS9 802.11ac Typ. Pout = 17dBm, EVM = -35dB, 64QAM/MCS7 Typ. Pout = 19dBm, EVM = -30dB, 64QAM/54Mbps Functional Block Diagram GND ANT GND SW_CTL Pin 1 Marking N/C 1 16 Vcc2 2 15 14 SPDT 13 12 GND 11 RX Vcc1 3 GND 4 5 Bias Network 10 GND 9 Vbat 678 TX GND PA_EN GND Top View Backside Paddle GND General Description The TQP887052 is a full WLAN front-end module in an ultra small 2.5 x 2.5 mm footprint package for 802.11ac applications. The module contains a 5 GHz PA and an SPDT switch. The architecture and interface are optimized for next generation WLAN integration into handset devices. The TQP887052 features chipset-specific compatible control voltages to facilitate ease of use. With its low power dissipation, the front-end module contributes to the extended battery life of next generation WLAN solutions. This TQP887052 is manufactured using TriQuint’s highreliability HBT and E/D pHEMT technologies. The module is assembled in an ultr...




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