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NCP81161 Dataheets PDF



Part Number NCP81161
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description VR12.5 Compatible Synchronous Buck MOSFET Drivers
Datasheet NCP81161 DatasheetNCP81161 Datasheet (PDF)

NCP81161 VR12.5 Compatible Synchronous Buck MOSFET Drivers The NCP81161 is a high performance dual MOSFET gate driver optimized to drive the gates of both high−side and low−side power MOSFETs in a synchronous buck converter. It can drive up to 3 nF load with a 25 ns propagation delay and 20 ns transition time. Adaptive anti−cross−conduction and power saving operation circuit can provide a low switching loss and high efficiency solution for notebook and desktop systems. Bidirectional EN pin can .

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NCP81161 VR12.5 Compatible Synchronous Buck MOSFET Drivers The NCP81161 is a high performance dual MOSFET gate driver optimized to drive the gates of both high−side and low−side power MOSFETs in a synchronous buck converter. It can drive up to 3 nF load with a 25 ns propagation delay and 20 ns transition time. Adaptive anti−cross−conduction and power saving operation circuit can provide a low switching loss and high efficiency solution for notebook and desktop systems. Bidirectional EN pin can provide a fault signal to controller when the gate driver fault detect under OVP, UVLO occur. Also, an under−voltage lockout function guarantees the outputs are low when supply voltage is low. Features • Faster Rise and Fall Times • Adaptive Anti−Cross−Conduction Circuit • Integrated Bootstrap Diode • Pre OV function • ZCD Detect • Floating Top Driver Accommodates Boost Voltages of up to 35 V • Output Disable Control Turns Off Both MOSFETs • Under−voltage Lockout • Power Saving Operation Under Light Load Conditions • Direct Interface to NCP6151 and Other Compatible PWM Controllers • Thermally Enhanced Package • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications • Power Solutions for Desktop Systems http://onsemi.com 1 DFN8 MN SUFFIX CASE 506AA MARKING DIAGRAM 1 A4MG G A4 = Specific Device Code M = Date Code G = Pb−Free Device ORDERING INFORMATION Device Package Shipping† NCP81161MNTBG DFN8 3000 / Tape & Reel (Pb−Free) NCP81161MNTWG DFN8 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2013 August, 2013 − Rev. 2 1 Publication Order Number: NCP81161/D VCC PWM NCP81161 BST 1 DRVH PWM EN FLAG 9 SW GND VCC DRVL (Top View) Figure 1. Pin Diagram Logic Anti−Cross Conduction VCC BST DRVH SW DRVL EN ZCD UVLO Detection Fault Pre−OV Figure 2. Block Diagram Table 1. Pin Descriptions Pin No. Symbol 1 BST 2 PWM 3 EN 4 VCC 5 DRVL 6 GND 7 SW 8 DRVH 9 FLAG Description Floating bootstrap supply pin for high side gate driver. Connect the bootstrap capacitor between this pin and the SW pin. Control input. The PWM signal has three distinctive states: Low = Low Side FET Enabled, Mid = Diode Emulation Enabled, High = High Side FET Enabled. Logic input. A logic high to enable the part and a logic low to disable the part. Power supply input. Connect a bypass capacitor (0.1 mF) from this pin to ground. Low side gate drive output. Connect to the gate of low side MOSFET. Bias and reference ground. All signals are referenced to this node (QFN Flag). Switch node. Connect this pin to the source of the high side MOSFET and drain of the low side MOSFET. High side gate drive output. Connect to the gate of high side MOSFET. Thermal flag. There is no electrical connection to the IC. Connect to ground plane. http://onsemi.com 2 12V_POWER R1 1.02 TP4 PWM DRON C5 1uF NCP81161 R143 R164 C4 0.027uF 0.0 NCP81161TP3 0.0 BST HG VREG_SW1_HG PWM SW VREG_SW1_OUT EN GND TP6 TP7 VCC LG VREG_SW1_LG PAD TP8 TP1 TP2 R142 Q1 NTMFS4821N C1 4.7uF C2 4.7uF + C3 CE9 4.7uF 390uF 0.0 TP5 L VCCP Q9 Q10 NTMFS4851N NTMFS4851N R3 2.2 235nH JP13_ETCH CSN11 C6 2700pF JP14_ETCH CSP11 Figure 3. Application Circuit Table 2. ABSOLUTE MAXIMUM RATINGS Pin Symbol VCC Pin Name Main Supply Voltage Input VMAX 15 V VMIN −0.3 V BST Bootstrap Supply Voltage 35 V wrt/ GND −0.3 V wrt/SW 40 V ≤ 50 ns wrt/ GND 15 V wrt/ SW SW Switching Node 35 V −5 V (Bootstrap Supply Return) 40 V ≤ 50 ns −10 V (200 ns) DRVH High Side Driver Output BST+0.3 V −0.3 V wrt/SW −2 V (<200 ns) wrt/SW DRVL Low Side Driver Output VCC+0.3 V −0.3 V DC −5 V (<200 ns) PWM DRVH and DRVL Control Input 6.5 V −0.3 V EN Enable Pin 6.5 V −0.3 V GND Ground 0V 0V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. THERMAL INFORMATION (All signals referenced to AGND unless noted otherwise) Symbol Parameter Value RqJA TJ TA TSTG MSL Thermal Characteristic (Note 1) Operating Junction Temperature Range (Note 2) Operating Ambient Temperature Range Maximum Storage Temperature Range Moisture Sensitivity Level 74 0 to 150 −10 to +125 −55 to +150 1 * The maximum package power dissipation must be observed. 1. I in2 Cu, 1 oz thickness. 2. Operation at −40°C to −10°C guaranteed by design, not production tested. Unit °C/W °C °C °C http://onsemi.com 3 NCP81161 Table 4. ELECTRICAL CHARACTERISTICS (Unless otherwise stated: −10°C < TA < +125°C; 4.5 V < VCC < 13.2 V, 4.5 V < BST−SWN < 13.2 V, 4.5 V < BST < 30 V, 0 V < SWN < 21 V) Parameter Test Conditions Min. Typ. Ma.


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