AR0835HS Image Sensor Datasheet

AR0835HS Datasheet, PDF, Equivalent


Part Number

AR0835HS

Description

1/3.2-Inch 8 Mp CMOS Digital Image Sensor

Manufacture

ON Semiconductor

Total Page 30 Pages
Datasheet
Download AR0835HS Datasheet


AR0835HS
AR0835HS
AR0835HS 1/3.2‐inch 8 Mp
CMOS Digital Image Sensor
Table 1. KEY PERFORMANCE PARAMETERS
Parameter
Array Format
Primary Modes
Pixel Size
Optical Format
Die Size
Input Clock Frequency
Interface
Subsampling Modes
Output Data Depth
Analog Gain
High Quality Bayer Scalar
Temperature Sensor
VCM AF Driver
3−D Support
Supply Voltage
Analog
Digital
Pixel
I/O
HiSPi/MIPI
Value
8 Mp: 3264 × 2448
6 Mp: 3264 × 1836
4:3 − 8 Mp 46 fps Max (HiSPi) and
42 fps Max (MIPI)
16:9 − 6 Mp at 60 fps Max
1080p 60 fps / 720p 120 fps Max
1.4 mm Back Side Illuminated (BSI)
1/3.2
6.86 mm × 6.44 mm (Area: 44.17 mm2)
6−27 MHz
HiSPi Mode: 4 lanes at 1 Gbps Max.
MIPI Mode: CSI−2 (2, 3, 4 lanes) at
896 Mbps max.
X − Bin2, Sum2 Skip: 2×, 4×
Y − Sum2, Skip: 2×, 4×, 8×
10-bit Raw, 10-to-8 bit A-Law, 8/6-bit DPCM
1×, 2×, 3×, 4×, 6×, 8×
Adjustable Scaling Up to 1/6× Scaling
10-bit, Single Instance on Chip,
Controlled by Two-wire Serial I/F
8-bit Resolution with Slew Rate Control
Frame Rate and Exposure Synchronization
2.5−3.1 V (2.8 V Nominal)
1.14−1.3 V (1.2 V Nominal)
2.5−3.1 V (2.8 V Nominal)
1.7−1.9 V (1.8 V Nominal) or
2.5−3.1 V (2.8 V Nominal)
1.14−1.3 V (1.2 V Nominal)
OTPM Program Voltage
Power Consumption
Responsivity
SNRMAX
Dynamic Range
Operating Temperature
Range (at Junction) −TJ
6.5 V
Typical 420 mW at 25°C for 8 Mp/46 fps and
6 Mp/60 fps
0.6 V/lux−sec
36 dB
64 dB
−30°C to +70°C
Features
High Speed Sensor Supporting 8 Mp (4:3) and 6 Mp (16:9) Up to
60 fps
1.4m Pixel with ON Semiconductor A−PixHSt Technology
Providing Best-in-class Low-light Performance
Optional On-chip High-quality Bayer Scaler to Resize Image to
Desired Size
www.onsemi.com
CLCC48 10 y 10
CASE 848AJ
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
Features (Continued)
Data Output Serial Interface: Four-lane
High-speed Serial Pixel Interface (HiSPi) or
Mobile Industry Processor Interface (MIPI)
Bit-depth Compression Available for Serial
Interface: 10-to-8 and 10-6 Bit Compression
to Enable Lower Bandwidth Receivers for
Full Frame Rate Applications
On-chip Temperature Sensor
On-die Phase-locked Loop (PLL) Oscillator
5.6 kbits One-time Programmable Memory
(OTPM) for Storing Module Information
and Calibration Data
On-chip 8-bit VCM Driver
3D Synchronization Controls to Enable
Stereo Video Capture
Interlaced Multi-exposure Readout Enabling
High Dynamic Range (HDR) Still and Video
Applications
Programmable Controls: Gain, Horizontal
and Vertical Blanking, Auto Black Level
Offset Correction, Frame Size/Rate,
Exposure, Left-right and Top-bottom Image
Reversal, Window Size, and Panning
Support for External Mechanical Shutter
Support for External LED or Xenon Flash
Applications
Sports Cameras
Digital Still Cameras
Digital Video Cameras
© Semiconductor Components Industries, LLC, 2012
February, 2017 − Rev. 4
1
Publication Order Number:
AR0835HS/D

AR0835HS
AR0835HS
Table 2. MODE OF OPERATION AND POWER CONSUMPTION
Mode
Active Readout
Window (Col y Row)
FULL RESOLUTION 4:3
Sensor Output Resolution
(Col y Row)
8 Mp
3264 × 2448
8 Mp
3264 × 2448
FULL RESOLUTION 16:9
3264 × 2448
3264 × 2448
6 Mp
6 Mp
4:3 VIDEO MODE
3264 × 1836
3264 × 1836
3264 × 1836
3264 × 1836
VGA
QVGA
16:9 VIDEO MODE
3264 × 2448
3264 × 2448
640 × 480
320 × 240
1080p
3264 × 1836
1920 × 1080
1080p
3264 × 1836
1920 × 1080
720p
3264 × 1836
1280 × 720
720p
3264 × 1836
1280 × 720
720p
3264 × 1836
1280 × 720
1. Gbps/Lane HiSPi and 896 Mbps/Lane MIPI data transfer rate.
2. Values measured at T = 25°C and nominal voltages.
Mode
Typical Power
Consumption
FPS (Note 2)
Full Mode
Full Mode
46/42
30
420 mW
370 mW
Full Mode
Full Mode
60
30
420 mW
370 mW
Skip4
Skip4
180 370 mW
240 370 mW
Scaling
Scaling
Bin2−Sum2
Scaling
Bin2 + Scaling
30
60
120
60
60
360 mW
420 mW
390 mW
420 mW
250 mW
ORDERING INFORMATION
Table 3. AVAILABLE PART NUMBERS
Part Number
AR0835HS3C12SUAA0−DP
Product Description
8 MP 1/3CIS
AR0835HS3C12SUAA0−DR
8 MP 1/3CIS
Orderable Product Attribute Description
Dry Pack with Protective Film
Dry Pack without Protective Film
See the ON Semiconductor Device Nomenclature
document (TND310/D) for a full description of the naming
convention used for image sensors. For reference
documentation, including information on evaluation kits,
please visit our web site at www.onsemi.com.
GENERAL DESCRIPTION
The AR0835HS from ON Semiconductor is a 1/3.2-inch
BSI (back side illuminated) CMOS active-pixel digital
image sensor with a pixel array of 3264 (H) × 2448 (V)
(3280 (H) × 2464 (V) including border pixels). It
incorporates sophisticated on-chip camera functions such as
mirroring, column and row skip modes, and context
switching for zero shutter lag snapshot mode. It is
programmable through a simple two-wire serial interface
and has very low power consumption.
The AR0835HS digital image sensor features
ON Semiconductor’s breakthrough low-noise 1.4 mm pixel
CMOS imaging technology that achieves near-CCD image
quality (based on signal-to-noise ratio and low-light
sensitivity) while maintaining the inherent size, cost, and
integration advantages of CMOS.
www.onsemi.com
2


Features AR0835HS AR0835HS 1/3.2‐inch 8 Mp CMO S Digital Image Sensor Table 1. KEY PE RFORMANCE PARAMETERS Parameter Array F ormat Primary Modes Pixel Size Optical Format Die Size Input Clock Frequency I nterface Subsampling Modes Output Data Depth Analog Gain High Quality Bayer Sc alar Temperature Sensor VCM AF Driver 3 −D Support Supply Voltage Analog Digi tal Pixel I/O HiSPi/MIPI Value 8 Mp: 3 264 × 2448 6 Mp: 3264 × 1836 4:3 − 8 Mp 46 fps Max (HiSPi) and 42 fps Max (MIPI) 16:9 − 6 Mp at 60 fps Max 1080 p 60 fps / 720p 120 fps Max 1.4 mm Back Side Illuminated (BSI) 1/3.2″ 6.86 m m × 6.44 mm (Area: 44.17 mm2) 6−27 M Hz HiSPi Mode: 4 lanes at 1 Gbps Max. M IPI Mode: CSI−2 (2, 3, 4 lanes) at 89 6 Mbps max. X − Bin2, Sum2 Skip: 2×, 4× Y − Sum2, Skip: 2×, 4×, 8× 10 -bit Raw, 10-to-8 bit A-Law, 8/6-bit DP CM 1×, 2×, 3×, 4×, 6×, 8× Adjusta ble Scaling Up to 1/6× Scaling 10-bit, Single Instance on Chip, Controlled by Two-wire Serial I/F 8-bit Resolution with Slew Rate Control Frame Rate and Exposure Synchroniza.
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