Switch IC. TCK107AG Datasheet


TCK107AG IC. Datasheet pdf. Equivalent


TCK107AG


1.0A Load Switch IC
TCK106AG/TCK107AG/TCK108AG
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCK106AG, TCK107AG, TCK108AG
1.0 A Load Switch IC with Slew Rate Control Driver in Ultra Small Package

The TCK106AG, TCK107AG and TCK108AG are load switch ICs for a general power management with slew rate control driver, featuring low ON resistance and wide input voltage operation from 1.1 to 5.5 V. ON resistance is only 34 mΩ typical at 5.0 V, -0.5 A condition and output current is available on 1.0 A. TCK107AG and TCK108AG feature output auto-discharge function.
These devices are available in 0.4 mm pitch ultra small package WCSP4D (0.79 mm x 0.79 mm, t: 0.55 mm) .Thus this devices is ideal for portable applications that require high-density board assembly such as cellular phone.

Weight: 0.79 mg (typ.)

WCSP4D

Feature
• Wide input voltage operation: VIN = 1.1 to 5.5 V • High output current: IOUT = 1.0 A • Low ON resistance :
RON = 34 mΩ (typ.) at VIN = 5.0 V, -0.5 A RON = 42 mΩ (typ.) at VIN = 3.3 V, -0.5 A RON = 71 mΩ (typ.) at VIN = 1.8 V, -0.5 A RON = 139 mΩ (typ.) at VIN = 1.2 V, -0.2 A RON = 176 mΩ (typ.) at VIN = 1.1 V, -0.2 A • Built in Slew rate control driver • Built in Auto-discharge (TCK107AG and TCK108AG) • Active High and Pull down connection between CONTROL and GND (TCK106AG and TCK107AG) • Active Low (TCK108AG) • Ultra small package : WCSP4D (0.79 mm x 0.79 mm, t: 0.55 mm)

P...



TCK107AG
TCK106AG/TCK107AG/TCK108AG
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCK106AG, TCK107AG, TCK108AG
1.0 A Load Switch IC with Slew Rate Control Driver in Ultra Small Package
The TCK106AG, TCK107AG and TCK108AG are load switch ICs
for a general power management with slew rate control driver,
featuring low ON resistance and wide input voltage operation from
1.1 to 5.5 V. ON resistance is only 34 mtypical at 5.0 V, -0.5 A
condition and output current is available on 1.0 A. TCK107AG and
TCK108AG feature output auto-discharge function.
These devices are available in 0.4 mm pitch ultra small package
WCSP4D (0.79 mm x 0.79 mm, t: 0.55 mm) .Thus this devices is
ideal for portable applications that require high-density board
assembly such as cellular phone.
Weight: 0.79 mg (typ.)
WCSP4D
Feature
Wide input voltage operation: VIN = 1.1 to 5.5 V
High output current: IOUT = 1.0 A
Low ON resistance :
RON = 34 m(typ.) at VIN = 5.0 V, -0.5 A
RON = 42 m(typ.) at VIN = 3.3 V, -0.5 A
RON = 71 m(typ.) at VIN = 1.8 V, -0.5 A
RON = 139 m(typ.) at VIN = 1.2 V, -0.2 A
RON = 176 m(typ.) at VIN = 1.1 V, -0.2 A
Built in Slew rate control driver
Built in Auto-discharge (TCK107AG and TCK108AG)
Active High and Pull down connection between CONTROL and GND (TCK106AG and TCK107AG)
Active Low (TCK108AG)
Ultra small package : WCSP4D (0.79 mm x 0.79 mm, t: 0.55 mm)
Pin Assignment(Top view)
VIN CONTROL
(A2) (B2)
Top marking
6M: TCK106AG
7M: TCK107AG
8M: TCK108AG
VOUT
(A1)
GND
(B1)
Index
Start of commercial production
2015-06
1 2015-05-29

TCK107AG
Absolute Maximum Ratings (Ta = 25°C)
TCK106AG/TCK107AG/TCK108AG
Characteristics
Symbol
Rating
Unit
Input voltage
Control voltage
Output voltage
Output current
Power dissipation
Operating temperature range
Junction temeperature
Storage temperature
VIN
VCT
VOUT
IOUT
PD
Topr
Tj
Tstg
-0.3 to 6.0
-0.3 to 6.0
-0.3 to VIN +0.3 (Note 1)
DC 1.0
800 (Note 2)
-40 to 85
150
-55 to 150
V
V
V
A
mW
°C
°C
°C
Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba
Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual
reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1 : VIN +0.3 6.0 V
Note 2: Rating at mounting on a board
(Glass epoxy board dimension: 40 mm x 40 mm, both sides of board
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5 mm x 28)
Block Diagram
TCK106AG, TCK107AG
TCK108AG
V
IN
VV
OUT IN
V
OUT
CONTROL
Slew Rate
Control Driver
Control
Logic
Output
Discharge (Note 3)
Pull
Down
CONTROL
Note 3: TCK107AG only
Operating conditions
Characteristics
Input voltage
Output current
CONTROL High-level input voltage
CONTROL Low-level input voltage
GND
Symbol
VIN
IOUT
VIH
VIL
Condition
1.1 V VIN 5.5 V
2
Slew Rate
Control Driver
Control
Logic
GND
Min Max Unit
1.1 5.5 V
1.0 A
0.9 V
0.4 V
2015-05-29




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