Document
Zener Diodes CDZ55C Series
CDZ55C Series
FEATURES
Silicon planar power zener diodes SMD chip pattern, available in various dimension included 0805(CDZ55C-S series) & 0603(CDZ55C-T
series) Leadfree and RoHS compliance components
MECHANICAL CHARACTERISTICS
Size: 1206 Weight: approx. 10mg Marking: Zener voltage & cathode terminal
DIMENSIONS
Dimension/mm L W T C
1206
3.2±0.2 1.5±0.2 0.85±0.1 0.55±0.2
MAXIMUM RATING & THERMAL CHARACTERISTICS1)
Parameter at Tamb=25oC1)
Symbol
Power Dissipation
Repetitive Peak Forward Current
Junction Temperature Thermal Resistance Junction to Ambient air Operating & Storage Temperature range
Ptot
IFRM
Tj RθJA Topr, stg
1) Valid provided that electrodes are kept at ambient temperature.
Value
500 200 150 300 -55 to 150
Unit
mW
mA oC oC/W oC
15-OCT-09 Document No.31004
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CDZ55C Series
ELECTRICAL CHARACTERISTICS1)
Parameter at Tamb=25oC1)
Symbol
Forward Voltage at IF=200mA Zener Voltage Tolerance, C=±5%
VF
1) Valid provided that electrodes are kept at ambient temperature.
Value 1.5 MAX
Unit V
Part Number
CDZ55C2V0 CDZ55C2V2 CDZ55C2V4 CDZ55C2V7 CDZ55C3V0 CDZ55C3V3 CDZ55C3V6 CDZ55C3V9 CDZ55C4V3 CDZ55C4V7 CDZ55C5V1 CDZ55C5V6 CDZ55C6V2 CDZ55C6V8 CDZ55C7V5 CDZ55C8V2 CDZ55C9V1 CDZ55C10 CDZ55C11 CDZ55C12 CDZ55C13 CDZ55C15 CDZ55C16 CDZ55C18 CDZ55C20 CDZ55C22 CDZ55C24 CDZ55C27 CDZ55C30 CDZ55C33 CDZ55C36 CDZ55C39 CDZ55C43 CDZ55C47 CDZ55C51
Marking Code
2 2V2 2V4 2V7
3 3V3 3V6 3V9 4V3 4V7 5V1 5V6 6V2 6V8 7V5 8V2 9V1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51
Nominal Zener Voltage
VZ @ IZT Min V Max V 1.90 2.10 2.09 2.31 2.28 2.52 2.57 2.84 2.85 3.15 3.14 3.47 3.42 3.78 3.71 4.10 4.09 4.52 4.47 4.94 4.85 5.36 5.32 5.88 5.89 6.51 6.46 7.14 7.13 7.88 7.79 8.61 8.65 9.56 9.50 10.50 10.45 11.55 11.40 12.60 12.35 13.65 14.25 15.75 15.20 16.80 17.10 18.90 19.00 21.00 20.90 23.10 22.80 25.20 25.65 28.35 28.50 31.50 31.35 34.65 34.20 37.80 37.05 40.95 40.85 45.15 44.65 49.35 48.45 53.55
Max Zener Impedance
ZZT @ IZT Ω mA 85 5 85 5 85 5 85 5 85 5 85 5 85 5 85 5 80 5 70 5 50 5 30 5 10 5 85 75 75 10 5 15 5 20 5 20 5 26 5 30 5 40 5 50 5 55 5 55 5 80 5 80 5 80 5 80 5 80 5 90 2.5 90 2.5 110 2.5 125 2.5
ZZK @ IZK Ω mA 600 1 600 1 600 1 600 1 600 1 600 1 600 1 600 1 600 1 600 1 550 1 450 1 200 1 150 1 50 1 50 1 50 1 70 1 70 1 90 1 110 1 110 1 170 1 170 1 220 1 220 1 220 1 220 1 220 1 220 1 220 1 500 0.5 600 0.5 700 0.5 700 0.5
Max Reverse Leakage Current IR @ VR
µA V 100 1 75 1 50 1 10 1
41 21 21 21 11 0.5 1 0.1 1 0.1 1 0.1 2 0.1 3 0.1 5 0.1 6.2 0.1 6.8 0.1 7.5 0.1 8.2 0.1 9.1 0.1 10 0.1 11 0.1 12 0.1 13 0.1 15 0.1 16 0.1 18 0.1 20 0.1 22 0.1 24 0.1 27 0.1 29.3 0.1 32.3 0.1 35.3 0.1 38.3
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CDZ55C Series
CDZ55C56 CDZ55C62 CDZ55C68 CDZ55C75
56
53.20 58.80 135
2.5 1000 0.5
0.1
42
62
58.90 65.10 150
2.5 1000 0.5
0.1 46.5
68
64.60 71.40 200
2.5 1000 0.5
0.1
51
75
71.25 78.75 250
2.5 1500 0.5
0.1 56.3
IF/ mA . Ptot-Admissible Power Dissipation/ mW
TYPICAL CHARACTERISTICS
Figure 1. Forward current vs Forward Voltage
200
180
160 140
120
100
80
60 40
20
0 0.6 0.7 0.8 0.9
1
VF/ V
1.1 1.2
Figure 2. Power De-rating
600 500 400 300 200 100
0 0 20 40 60 80 100 120 140 160 180 200
Tamb-Ambient Temperature/oC
TEST CHARACTERISTICS
Test Item Solderability Resistance to Soldering Heat Humidity Steady State Continue Forward Operating Life Thermal Shock Bending Strength
Test Condition Sn bath at 245±5oC for 2±0.5s
Sn bath at 260±5oC for 10±2s
At 85oC 85%RH for 168hrs
At 25oC IF =1.1IF for 1000hrs -55 ±5oC/5min to 150±5oC/5min for 10cycles Bending up to 2mm for 1cycle
Requirement
>95% area tin covered VZ, ZZT, ZZK, IR & VF within spec; no mechanical damage VZ, ZZT, ZZK, IR & VF within spec
VZ, ZZT, ZZK, IR & VF within spec
VZ, ZZT, ZZK, IR & VF within spec VZ, ZZT, ZZK, IR & VF within spec; no mechanical damage
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CDZ55C Series
APPLICATIONS
Function: constant voltage control Soldering Condition:
Soldering Condition & Caution ■ Recommended Soldering Condition (Refer to IPC/JEDEC J-STD-020D 4-1&5.2)
Recommended Profile Condition
Sn-Pb Soldering
Ramp-up rate (from pre-heat stage) Pre-heat Temperature & Time
Soldering Temperature & Time
Peak Temperature Time within 5oC of peak temperature Ramp-down rate Time 25oC to peak temperature
<3oC/s 100-150 oC
60-120s 183 oC
60-150s 230±5oC <260oC
10-20s <6oC/s
<6min
Leadfree
Soldering <3oC/s 150-200 oC
60-120s 217 oC
60-150s 245±5oC <260oC
20-30s <6oC/s
<8min
Wave Soldering
△T<150oC 100-150 oC
60-120s 260±5oC
5±2s
260±5oC
<6oC/s
-
Manual Soldering: Approx. 350oC for 3s, avoid solder iron tip direct touch the components body
Recommended Soldering Profile
T/oC
Fig1: Reflow soldering profile for lead-free solder (SnAgCu)
15-OCT-09 Document No.31004
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t/s
CDZ55C Series
T/oC
t/s
Fig2: Wave soldering profile
*1. The recommended profiles are referring to IPC/JEDEC J-STD-020D & IEC-60068-2-58 *2. Chip diodes are able to stand maximum.