Document
Switching Diode CD4148WTP
CD4148WTP
FEATURES Silicon epitaxial planar diode SMD chip pattern, available in various dimension included 1206 & 0805 Leadfree and RoHS compliance components For small signal switching and operating ambient temperature less than 55oC and voltage withstand less than 60V; not suitable for AC switching input as rectified circuit and high reverse voltage location. CD4148WTN is suitable for those application
MECHANICAL CHARACTERISTICS Size: 0603 Weight: approx. 4mg Marking: Cathode terminal
DIMENSIONS
Dimension/mm L W T C
0603
1.55±0.1 0.80±0.1 0.65±0.1 0.35±0.1
THERMAL CHARACTERISTICS1)
Parameter at Tamb=25oC1)
Symbol
Forward Power Dissipation Power derating above 25oC
Ptot
Junction Temperature
Tj
Thermal Resistance Junction to Ambient air
RθJA
Operating& Storage Temperature range
Tstg
1) Valid provided that electrodes are kept at ambient temperature.
Value
200
1.6 150 375 -55 to 150
Unit
mW
mW/ oC oC
oC/W oC
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CD4148WTP
MAXIMUM RATING1)
Parameter at Tamb=25oC1)
Symbol
Repetitive Peak Reverse Voltage Average rectified current sin half wave rectification with resistive load
VRRM IF(AV)
Repetitive Peak Forward Current at Tamb=25°C
Non-Repetitive Surge Forward Current at t<1s and Tj=25oC at t≦8.3ms and Tj=25oC
IFRM IFSM
1) Valid provided that electrodes are kept at ambient temperature.
ELECTRICAL CHARACTERISTICS1)
Parameter at Tamb=25oC1)
Symbol
Forward Voltage at IF=10mA at IF=100mA
Leakage Current at VR=20V Leakage Current at VR=75V Capacitance at VR=0V, f=1MHz Reverse Recovery Time at IF =IR=10mA,RL=100Ω
VF
IR Ctot trr
1) Valid provided that electrodes are kept at ambient temperature.
Value 75 100 200 400 800
Value 1.0 MAX 1.25 MAX 0.025 MAX 5 MAX 4 MAX 4 MAX
Unit V mA mA mA mA
Unit V V uA uA pF ns
TYPICAL CHARACTERISTICS
Figure 1. Forward Characteristic
Ptot-Admissible Power Dissipation/ mW .
Figure 2. Power De-rating
500 400 300 200 100
0 0 20 40 60 80 100 120 140 160 180 200
Tamb-Ambient Temperature/oC
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IF/ mA . . VR/ V . .
CD4148WTP
Figure 3. Forward Current De-rating
500
400
300
200
100
0 0 20 40 60 80 100 120 140 160 180 200
Tamb-Ambient Temperature/oC
Figure 4. Reverse Voltage De-rating
200
150
100
50
0 0 20 40 60 80 100 120 140 160 180 200
Tamb-Ambient Temperature/oC
TEST CHARACTERISTICS
Test Item Solderability Resistance to Soldering Heat Humidity Steady State
Test Condition Sn bath at 245±5oC for 2±0.5s Sn bath at 260±5oC for 10±2s At 85oC 85%RH for 168hrs
Requirement
>95% area tin covered VF,VR & IR within spec; no mechanical damage VF,VR & IR within spec
Continue Forward Operating Life Thermal Shock Bending Strength
At 25oC IF =1.1IF for 1000hrs -55 ±5oC/5min to 150±5oC/5min for 10cycles
Bending up to 2mm for 1cycle
VF,VR & IR within spec
VF,VR & IR within spec VF,VR & IR within spec; no mechanical damage
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APPLICATIONS
Function: suit for small signal switching application Typical Application circuit:
CD4148WTP
Typical Product field: General application except high reverse voltage location
Soldering Condition:
Soldering Condition & Caution
■ Recommended Soldering Condition (Refer to IPC/JEDEC J-STD-020D 4-1&5.2)
Recommended Profile Condition Ramp-up rate (from pre-heat stage) Pre-heat Temperature & Time
Soldering Temperature & Time
Peak Temperature Time within 5oC of peak temperature Ramp-down rate Time 25oC to peak temperature
Sn-Pb Soldering
<3oC/s 100-150 oC
60-120s 183 oC 60-150s 230±5oC <260oC 10-20s <6oC/s <6min
Leadfree
Soldering <3oC/s 150-200 oC
60-120s 217 oC
60-150s 245±5oC <260oC
20-30s <6oC/s
<8min
Wave Soldering
△T<150oC 100-150 oC
60-120s 260±5oC
5±2s
260±5oC
<6oC/s
-
Manual Soldering: Approx. 350oC for 3s, avoid solder iron tip direct touch the components body
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Recommended Soldering Profile T/oC
CD4148WTP
Fig1: Reflow soldering profile for lead-free solder (SnAgCu) T/oC
t/s
t/s
Fig2: Wave soldering profile *1. The recommended profiles are referring to IPC/JEDEC J-STD-020D & IEC-60068-2-58 *2. Chip diodes are able to stand maximum soldering temperature up to 260oC max for 10s, and the
soldering cycles with max 3 times, referring to IEC-60068-2-58
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Recommended Soldering Footprint:
CD4148WTP
■ Reflow/Wave Soldering
Product Size 0603
A 1.8-2.6
Dimension/ mm BC 0.8 0.5-0.9
D 0.8-1.0
Storage Condition: Product termination solderability can degrade due to high temperature and humidity or chemical environment. Storage condition must be in an ambient temperature of <40oC
and ambient humidity of <75%RH, and free from chemical.
ENVIRONMENTAL CHARACTERISTICS Product Product
Hazardous Substance or Element/ppm Pb Cd Hg Cr6+ PBB PBDE
<1000 <100 <1000 <1000 <1000 <1000
F
<900
Halogen Substance/ ppm
Cl Br
I
<900
<900
<900
Total
<1500
PACKING METHOD Product
Quality/Reel 5,000pcs
Reel Size 7”
Tape Paper
DISCLAIMERS These products are not .