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CD4148WTP Dataheets PDF



Part Number CD4148WTP
Manufacturers Crownpo Technology
Logo Crownpo Technology
Description Switching Diode
Datasheet CD4148WTP DatasheetCD4148WTP Datasheet (PDF)

Switching Diode CD4148WTP CD4148WTP FEATURES Silicon epitaxial planar diode SMD chip pattern, available in various dimension included 1206 & 0805 Leadfree and RoHS compliance components For small signal switching and operating ambient temperature less than 55oC and voltage withstand less than 60V; not suitable for AC switching input as rectified circuit and high reverse voltage location. CD4148WTN is suitable for those application MECHANICAL CHARACTERISTICS Size: 0603 Weight: approx. 4mg Marki.

  CD4148WTP   CD4148WTP


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Switching Diode CD4148WTP CD4148WTP FEATURES Silicon epitaxial planar diode SMD chip pattern, available in various dimension included 1206 & 0805 Leadfree and RoHS compliance components For small signal switching and operating ambient temperature less than 55oC and voltage withstand less than 60V; not suitable for AC switching input as rectified circuit and high reverse voltage location. CD4148WTN is suitable for those application MECHANICAL CHARACTERISTICS Size: 0603 Weight: approx. 4mg Marking: Cathode terminal DIMENSIONS Dimension/mm L W T C 0603 1.55±0.1 0.80±0.1 0.65±0.1 0.35±0.1 THERMAL CHARACTERISTICS1) Parameter at Tamb=25oC1) Symbol Forward Power Dissipation Power derating above 25oC Ptot Junction Temperature Tj Thermal Resistance Junction to Ambient air RθJA Operating& Storage Temperature range Tstg 1) Valid provided that electrodes are kept at ambient temperature. Value 200 1.6 150 375 -55 to 150 Unit mW mW/ oC oC oC/W oC 25-NOV-10 Document No.32002 1 CD4148WTP MAXIMUM RATING1) Parameter at Tamb=25oC1) Symbol Repetitive Peak Reverse Voltage Average rectified current sin half wave rectification with resistive load VRRM IF(AV) Repetitive Peak Forward Current at Tamb=25°C Non-Repetitive Surge Forward Current at t<1s and Tj=25oC at t≦8.3ms and Tj=25oC IFRM IFSM 1) Valid provided that electrodes are kept at ambient temperature. ELECTRICAL CHARACTERISTICS1) Parameter at Tamb=25oC1) Symbol Forward Voltage at IF=10mA at IF=100mA Leakage Current at VR=20V Leakage Current at VR=75V Capacitance at VR=0V, f=1MHz Reverse Recovery Time at IF =IR=10mA,RL=100Ω VF IR Ctot trr 1) Valid provided that electrodes are kept at ambient temperature. Value 75 100 200 400 800 Value 1.0 MAX 1.25 MAX 0.025 MAX 5 MAX 4 MAX 4 MAX Unit V mA mA mA mA Unit V V uA uA pF ns TYPICAL CHARACTERISTICS Figure 1. Forward Characteristic Ptot-Admissible Power Dissipation/ mW . Figure 2. Power De-rating 500 400 300 200 100 0 0 20 40 60 80 100 120 140 160 180 200 Tamb-Ambient Temperature/oC 25-NOV-10 Document No.32002 2 IF/ mA . . VR/ V . . CD4148WTP Figure 3. Forward Current De-rating 500 400 300 200 100 0 0 20 40 60 80 100 120 140 160 180 200 Tamb-Ambient Temperature/oC Figure 4. Reverse Voltage De-rating 200 150 100 50 0 0 20 40 60 80 100 120 140 160 180 200 Tamb-Ambient Temperature/oC TEST CHARACTERISTICS Test Item Solderability Resistance to Soldering Heat Humidity Steady State Test Condition Sn bath at 245±5oC for 2±0.5s Sn bath at 260±5oC for 10±2s At 85oC 85%RH for 168hrs Requirement >95% area tin covered VF,VR & IR within spec; no mechanical damage VF,VR & IR within spec Continue Forward Operating Life Thermal Shock Bending Strength At 25oC IF =1.1IF for 1000hrs -55 ±5oC/5min to 150±5oC/5min for 10cycles Bending up to 2mm for 1cycle VF,VR & IR within spec VF,VR & IR within spec VF,VR & IR within spec; no mechanical damage 25-NOV-10 Document No.32002 3 APPLICATIONS Function: suit for small signal switching application Typical Application circuit: CD4148WTP Typical Product field: General application except high reverse voltage location Soldering Condition: Soldering Condition & Caution ■ Recommended Soldering Condition (Refer to IPC/JEDEC J-STD-020D 4-1&5.2) Recommended Profile Condition Ramp-up rate (from pre-heat stage) Pre-heat Temperature & Time Soldering Temperature & Time Peak Temperature Time within 5oC of peak temperature Ramp-down rate Time 25oC to peak temperature Sn-Pb Soldering <3oC/s 100-150 oC 60-120s 183 oC 60-150s 230±5oC <260oC 10-20s <6oC/s <6min Leadfree Soldering <3oC/s 150-200 oC 60-120s 217 oC 60-150s 245±5oC <260oC 20-30s <6oC/s <8min Wave Soldering △T<150oC 100-150 oC 60-120s 260±5oC 5±2s 260±5oC <6oC/s - Manual Soldering: Approx. 350oC for 3s, avoid solder iron tip direct touch the components body 25-NOV-10 Document No.32002 4 Recommended Soldering Profile T/oC CD4148WTP Fig1: Reflow soldering profile for lead-free solder (SnAgCu) T/oC t/s t/s Fig2: Wave soldering profile *1. The recommended profiles are referring to IPC/JEDEC J-STD-020D & IEC-60068-2-58 *2. Chip diodes are able to stand maximum soldering temperature up to 260oC max for 10s, and the soldering cycles with max 3 times, referring to IEC-60068-2-58 25-NOV-10 Document No.32002 5 Recommended Soldering Footprint: CD4148WTP ■ Reflow/Wave Soldering Product Size 0603 A 1.8-2.6 Dimension/ mm BC 0.8 0.5-0.9 D 0.8-1.0 Storage Condition: Product termination solderability can degrade due to high temperature and humidity or chemical environment. Storage condition must be in an ambient temperature of <40oC and ambient humidity of <75%RH, and free from chemical. ENVIRONMENTAL CHARACTERISTICS Product Product Hazardous Substance or Element/ppm Pb Cd Hg Cr6+ PBB PBDE <1000 <100 <1000 <1000 <1000 <1000 F <900 Halogen Substance/ ppm Cl Br I <900 <900 <900 Total <1500 PACKING METHOD Product Quality/Reel 5,000pcs Reel Size 7” Tape Paper DISCLAIMERS These products are not .


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