Document
Zener Diodes CDZ55C-S Series
CDZ55C-S Series
FEATURES
Silicon planar power zener diodes SMD chip pattern, available in various dimension included 1206(CDZ55C series) & 0603(CDZ55C-T
series) Leadfree and RoHS compliance components
MECHANICAL CHARACTERISTICS
Size: 0805 Weight: approx. 6mg Marking: Zener voltage & cathode terminal
DIMENSIONS
Dimension/mm L W T C
0805
2.0±0.2 1.25±0.2 0.85±0.1 0.45±0.2
MAXIMUM RATING & THERMAL CHARACTERISTICS1)
Parameter at Tamb=25oC1)
Symbol
Power Dissipation
Ptot
Repetitive Peak Forward Current
IFRM
Junction Temperature
Thermal Resistance Junction to Ambient air Operating & Storage Temperature range
Tj RθJA Topr, stg
1) Valid provided that electrodes are kept at ambient temperature.
Value
500 200 150 300 -55 to 150
Unit
mW
mA oC oC/W oC
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CDZ55C-S Series
ELECTRICAL CHARACTERISTICS1)
Parameter at Tamb=25oC1)
Symbol
Forward Voltage at IF=200mA Zener Voltage Tolerance, C=±5%
VF
1) Valid provided that electrodes are kept at ambient temperature.
Value 1.5 MAX
Unit V
Part Number
CDZ55C2V0S CDZ55C2V2S CDZ55C2V4S CDZ55C2V7S CDZ55C3V0S CDZ55C3V3S CDZ55C3V6S CDZ55C3V9S CDZ55C4V3S CDZ55C4V7S CDZ55C5V1S CDZ55C5V6S CDZ55C6V2S CDZ55C6V8S CDZ55C7V5S CDZ55C8V2S CDZ55C9V1S CDZ55C10S CDZ55C11S CDZ55C12S CDZ55C13S CDZ55C15S CDZ55C16S CDZ55C18S CDZ55C20S CDZ55C22S CDZ55C24S CDZ55C27S CDZ55C30S CDZ55C33S CDZ55C36S CDZ55C39S CDZ55C43S CDZ55C47S CDZ55C51S
Marking Code
2 2V2 2V4 2V7
3 3V3 3V6 3V9 4V3 4V7 5V1 5V6 6V2 6V8 7V5 8V2 9V1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51
Nominal Zener Voltage
VZ @ IZT Min V Max V 1.90 2.10 2.09 2.31 2.28 2.52 2.57 2.84 2.85 3.15 3.14 3.47 3.42 3.78 3.71 4.10 4.09 4.52 4.47 4.94 4.85 5.36 5.32 5.88 5.89 6.51 6.46 7.14 7.13 7.88 7.79 8.61 8.65 9.56 9.50 10.50 10.45 11.55 11.40 12.60 12.35 13.65 14.25 15.75 15.20 16.80 17.10 18.90 19.00 21.00 20.90 23.10 22.80 25.20 25.65 28.35 28.50 31.50 31.35 34.65 34.20 37.80 37.05 40.95 40.85 45.15 44.65 49.35 48.45 53.55
Max Zener Impedance
ZZT @ IZT Ω mA 85 5 85 5 85 5 85 5 85 5 85 5 85 5 85 5 80 5 70 5
50 5 30 5 10 5 85 75 75 10 5 15 5 20 5 20 5 26 5 30 5 40 5 50 5 55 5 55 5 80 5 80 5 80 5 80 5 80 5 90 2.5 90 2.5 110 2.5 125 2.5
ZZK @ IZK Ω mA 600 1 600 1 600 1 600 1 600 1 600 1 600 1 600 1 600 1 600 1 550 1 450 1 200 1 150 1 50 1 50 1 50 1 70 1 70 1 90 1 110 1 110 1 170 1 170 1 220 1 220 1 220 1 220 1 220 1 220 1 220 1 500 0.5 600 0.5 700 0.5 700 0.5
Max Reverse Leakage Current IR @ VR
µA V 100 1 75 1 50 1 10 1
41 21 21 21 11 0.5 1 0.1 1 0.1 1 0.1 2 0.1 3 0.1 5 0.1 6.2 0.1 6.8 0.1 7.5 0.1 8.2 0.1 9.1 0.1 10 0.1 11 0.1 12 0.1 13 0.1 15 0.1 16 0.1 18 0.1 20 0.1 22 0.1 24 0.1 27 0.1 29.3 0.1 32.3 0.1 35.3 0.1 38.3
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CDZ55C-S Series
CDZ55C56S CDZ55C62S CDZ55C68S CDZ55C75S
56
53.20 58.80 135
2.5 1000 0.5
0.1
42
62
58.90 65.10 150
2.5 1000 0.5
0.1 46.5
68
64.60 71.40 200
2.5 1000 0.5
0.1
51
75
71.25 78.75 250
2.5 1500 0.5
0.1 56.3
IF/ mA . Ptot-Admissible Power Dissipation/ mW
TYPICAL CHARACTERISTICS
Figure 1. Forward current vs Forward Voltage
200
180
160 140
120
100
80
60 40
20
0 0.6 0.7 0.8 0.9
1
VF/ V
1.1 1.2
Figure 2. Power De-rating
600 500 400 300 200 100
0 0 20 40 60 80 100 120 140 160 180 200
Tamb-Ambient Temperature/oC
TEST CHARACTERISTICS
Test Item Solderability Resistance to Soldering Heat Humidity Steady State Continue Forward Operating Life Thermal Shock Bending Strength
Test Condition Sn bath at 245±5oC for 2±0.5s
Sn bath at 260±5oC for 10±2s
At 85oC 85%RH for 168hrs
At 25oC IF =1.1IF for 1000hrs -55 ±5oC/5min to 150±5oC/5min for 10cycles Bending up to 2mm for 1cycle
Requirement
>95% area tin covered VZ, ZZT, ZZK, IR & VF within spec; no mechanical damage VZ, ZZT, ZZK, IR & VF within spec
VZ, ZZT, ZZK, IR & VF within spec
VZ, ZZT, ZZK, IR & VF within spec VZ, ZZT, ZZK, IR & VF within spec; no mechanical damage
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CDZ55C-S Series
APPLICATIONS
Function: constant voltage control Soldering Condition:
Soldering Condition & Caution ■ Recommended Soldering Condition (Refer to IPC/JEDEC J-STD-020D 4-1&5.2)
Recommended Profile Condition
Sn-Pb Soldering
Ramp-up rate (from pre-heat stage) Pre-heat Temperature & Time
Soldering Temperature & Time
Peak Temperature Time within 5oC of peak temperature Ramp-down rate Time 25oC to peak temperature
<3oC/s 100-150 oC
60-120s 183 oC
60-150s 230±5oC <260oC
10-20s <6oC/s
<6min
Leadfree
Soldering <3oC/s 150-200 oC
60-120s 217 oC
60-150s 245±5oC <260oC
20-30s <6oC/s
<8min
Wave Soldering
△T<150oC 100-150 oC
60-120s 260±5oC
5±2s
260±5oC
<6oC/s
-
Manual Soldering: Approx. 350oC for 3s, avoid solder iron tip direct touch the components body
Recommended Soldering Profile
T/oC
Fig1: Reflow soldering profile for lead-free solder (SnAgCu)
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t/s
CDZ55C-S Series
T/oC
t/s
Fig2: Wave soldering profile
*1. The recommended profiles are referring to IPC/JEDEC J-STD-020D & IEC.