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ESD7C Dataheets PDF



Part Number ESD7C
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Transient Voltage Suppressors
Datasheet ESD7C DatasheetESD7C Datasheet (PDF)

ESD7C, SZESD7C SERIES Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection The ESD7CxxD Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. Specificati.

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ESD7C, SZESD7C SERIES Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection The ESD7CxxD Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. Specification Features: • Low Capacitance 6.2 pF to 13 pF • Low Clamping Voltage • Small Body Outline Dimensions: 0.047″ x 0.047″ (1.20 mm x 1.20 mm) • Low Body Height: 0.020″ (0.5 mm) • Stand−off Voltage: 3.3 V, 5 V • Low Leakage • Response Time < 1 ns • ESD Rating of Class 3 (> 16 kV) per Human Body Model • IEC61000−4−2 Level 4 ESD Protection • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These are Pb−Free Devices Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating IEC 61000−4−2 (ESD) Contact Air Symbol Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Derate above 25°C Thermal Resistance Junction−to−Ambient Junction and Storage Temperature Range ⎪ PD RqJA TJ, Tstg Value ±8.0 ±15 240 1.9 525 −55 to +150 Unit kV mW mW/°C °C/W °C http://onsemi.com PIN 1. CATHODE 2. CATHODE 3. ANODE 1 2 3 MARKING DIAGRAM SOT−723 CASE 631AA L5 M 1 L5 = Specific Device Code M = Date Code *Date Code orientation and/or position may vary depending upon manufacturing location. ORDERING INFORMATION Device ESD7CxxDT5G Package SOT−723 (Pb−Free) Shipping† 8000 / Tape & Reel SZESD7CxxDT5G SOT−723 (Pb−Free) 8000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the table on page 2 of this data sheet. Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. © Semiconductor Components Industries, LLC, 2012 March, 2012 − Rev. 3 1 Publication Order Number: ESD7C3.3D/D ESD7C, SZESD7C SERIES ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter IPP VC VRWM IR VBR IT IF VF Ppk C Maximum Reverse Peak Pulse Current Clampin.


SZESD5Z2.5T1G ESD7C SZESD7C


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