ESD9B3.3ST5G

ESD9B, SZESD9B ESD Protection Diode Micro−Packaged Diodes for ESD Protection The ESD9B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in cellular phones, MP3 players, digital cameras and many other portable applications where board space comes at a premium. www.onsemi.com Specification Features Low Capacitance 15 pF Low Clamping Voltage Small Body Outline Dimensions: 0.039″ x 0.024″ (1.0mm x 0.60mm) Low Body Height: 0.016″ (0.4 mm) Stand−off Voltage: 3.3 V, 5 V Low Leakage Response Time is < 1 ns IEC61000−4−2 Level 4 ESD Protection AEC−Q101 Qualified and PPAP Capable SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements This is a Pb−Free Device Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact Air ±18 kV ±18 IEC 61000−4−4 (EFT) 40 A Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) °PD° RqJA TJ, Tst...