SYNCHRONOUS DRAM. IS42S16160 Datasheet

IS42S16160 DRAM. Datasheet pdf. Equivalent

Part IS42S16160
Description 16Meg x16 256-MBIT SYNCHRONOUS DRAM
Feature IS42S16160 16Meg x16 256-MBIT SYNCHRONOUS DRAM SEPTEMBER 2009 FEATURES • Clock frequency: 16.
Manufacture Integrated Silicon Solution
Datasheet
Download IS42S16160 Datasheet



IS42S16160
IS42S16160
16Meg x16
256-MBIT SYNCHRONOUS DRAM
SEPTEMBER 2009
FEATURES
• Clock frequency: 166, 143, 133 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Power supply
IS42S16160
Vdd Vddq
3.3V 3.3V
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Auto Refresh (CBR)
• Self Refresh
• 8K refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
• Available in Industrial Temperature
• Available in 54-pin TSOP-II and 54-ball TF-BGA
• Available in Lead-free
OVERVIEW
ISSI's 256Mb Synchronous DRAM achieves high-speed
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock input.
The 256Mb SDRAM is organized as follows.
IS42S16160
4M x16x4 Banks
54-pin TSOPII
54-ball TF-BGA
KEY TIMING PARAMETERS
Parameter
Clk Cycle Time
CAS Latency = 3
CAS Latency = 2
Clk Frequency
CAS Latency = 3
CAS Latency = 2
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
-6 -7
6 7
10 10
166 143
100 100
5.4 5.4
8 8
-75E Unit
– ns
7.5 ns
– Mhz
133 Mhz
– ns
5.5 ns
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with-
out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain
the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
Rev.  C
09/15/09
1



IS42S16160
IS42S16160
DEVICE OVERVIEW
The 256Mb SDRAM is a high speed CMOS, dynamic
random-access memory designed to operate in 3.3V Vdd
and 3.3V Vddq memory systems containing 268,435,456
bits. Internally configured as a quad-bank DRAM with a
synchronous interface. Each 67,108,864-bit bank is orga-
nized as 8,192 rows by 512 columns by 16 bits.
The 256Mb SDRAM includes an AUTO REFRESH MODE,
and a power-saving, power-down mode. All signals are
registered on the positive edge of the clock signal, CLK.
All inputs and outputs are LVTTL compatible.
The 256Mb SDRAM has the ability to synchronously burst
data at a high data rate with automatic column-address
generation, the ability to interleave between internal banks
to hide precharge time and the capability to randomly
change column addresses on each clock cycle during
burst access.
A self-timed row precharge initiated at the end of the burst
sequence is available with the AUTO PRECHARGE function
enabled.  Precharge one bank while accessing one of the
other three banks will hide the precharge cycles and provide
seamless, high-speed, random-access operation.
SDRAM read and write accesses are burst oriented starting
at a selected location and continuing for a programmed
number of locations in a programmed sequence. The
registration of an ACTIVE command begins accesses,
followed by a READ or WRITE command. The ACTIVE
command in conjunction with address bits registered are
used to select the bank and row to be accessed (BA0,
BA1 select the bank; A0-A12 select the row). The READ
or WRITE commands in conjunction with address bits
registered are used to select the starting column location
for the burst access.
Programmable READ or WRITE burst lengths consist of
1, 2, 4 and 8 locations or full page, with a burst terminate
option.
FUNCTIONAL BLOCK DIAGRAM (For 4MX16X4 Banks SHOWN)
CLK
CKE
CS
RAS
CAS
WE
A10
A12
A11
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
BA0
BA1
COMMAND
DECODER
&
CLOCK
GENERATOR
MODE
REGISTER
13
ROW
ADDRESS
13 LATCH
REFRESH
CONTROLLER
SELF
REFRESH
CONTROLLER
REFRESH
COUNTER
ROW
ADDRESS
BUFFER
13
13
DATA IN
BUFFER
16 16
2
DQML
DQMH
DQ 0-15
DATA OUT
BUFFER
16 16
VDD/VDDQ
Vss/VssQ
8192
8192
8192
8192
MEMORY CELL
ARRAY
BANK 0
SENSE AMP I/O GATE
COLUMN
ADDRESS LATCH
9
BURST COUNTER
COLUMN
ADDRESS BUFFER
BANK CONTROL LOGIC
512
(x 16)
COLUMN DECODER
9
2 Integrated Silicon Solution, Inc. — www.issi.com
Rev.  C
09/15/09





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