3-Axis Accelerometer. MC3410 Datasheet

MC3410 Accelerometer. Datasheet pdf. Equivalent

Part MC3410
Description 3-Axis Accelerometer
Feature MC3410 3-Axis Accelerometer GENERAL DESCRIPTION FEATURES Datasheet The MC3410 is a low-noise, in.
Manufacture mCube
Datasheet
Download MC3410 Datasheet



MC3410
MC3410 3-Axis Accelerometer
GENERAL DESCRIPTION
FEATURES
Datasheet
The MC3410 is a low-noise, integrated
digital output 3-axis accelerometer with a
feature set optimized for cell phones and
consumer product motion sensing.
Applications include user interface control,
gaming motion input, electronic compass tilt
compensation for cell phones, game
controllers, remote controls and portable
media products.
Accurate event detection is enabled with a
low noise architecture that minimizes false
triggering found in competing devices. Low
noise and low power are inherent in the
monolithic fabrication approach, where the
MEMS accelerometer is integrated in a
single-chip with the electronics integrated
circuit.
In the MC3410 the internal sample rate is
fixed at 1024 samples / second. Specific
orientation and gesture conditions can
trigger an interrupt to a remote MCU.
Alternatively, the device supports the
reading of sample and event status via
polling.
Range & Sampling
± 2g / ± 4g / ± 8g ranges
10-bit or 14-bit resolution
1024 samples/sec
Programmable low pass filter
From 8 to 512 Hz bandwidth
Event Detection
Low-noise architecture minimizes
false triggering
Tap, Shake, Drop
Portrait or landscape orientation with
programmable hysteresis
Tilt detection in six orientations
Simple System Integration
I2C interface, up to 400 kHz
2 × 2 × 0.92 mm 12-pin package
Pin-compatible to Bosch BMA2xx
Single-chip 3D silicon MEMS
100µg / √Hz noise
mCube Proprietary.
APS-048-0010v2.2
© 2014 mCube Inc. All rights reserved.
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MC3410
MC3410 3-Axis Accelerometer
Datasheet
TABLE OF CONTENTS
1 Order Information............................................................................................................. 5
2 Functional Block Diagram ................................................................................................ 6
3 Packaging and Pin Description ........................................................................................ 7
3.1 Package Outline................................................................................................................... 7
3.2 Pin Description..................................................................................................................... 8
3.3 Typical Application Circuit .................................................................................................... 9
3.4 Tape and Reel ................................................................................................................... 10
4 Specifications................................................................................................................. 12
4.1 Absolute Maximum Ratings................................................................................................ 12
4.2 Sensor Characteristics ....................................................................................................... 13
4.3 Electrical and Timing Characteristics.................................................................................. 14
4.3.1 Electrical Power and Internal Characteristics....................................................... 14
4.3.2 I2C Electrical Characteristics ............................................................................... 15
4.3.3 I2C Timing Characteristics ................................................................................... 16
5 General Operation ......................................................................................................... 17
5.1 Sensor Sampling................................................................................................................ 17
5.2 Offset and Gain Calibration ................................................................................................ 18
6 Operational States ......................................................................................................... 19
7 Operational State Flow .................................................................................................. 20
8 Interrupts........................................................................................................................ 21
8.1 Enabling and Clearing Interrupts ........................................................................................ 21
8.2 Interrupt Support ................................................................................................................ 22
8.3 GINT Interrupt .................................................................................................................... 23
8.4 Event Detection.................................................................................................................. 24
9 Orientation Detection ..................................................................................................... 25
9.1 Orientation Hysteresis ........................................................................................................ 25
9.2 Portrait/Landscape Events ................................................................................................. 25
9.3 Front/Back Events.............................................................................................................. 30
9.4 Shake Detection................................................................................................................. 32
9.5 Drop Detection ................................................................................................................... 34
mCube Proprietary.
APS-048-0010v2.2
© 2014 mCube Inc. All rights reserved.
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