Optical Transceiver. AFBR-57R5APZ Datasheet

AFBR-57R5APZ Transceiver. Datasheet pdf. Equivalent

Part AFBR-57R5APZ
Description RoHS Compliant Optical Transceiver
Feature AFBR-57R5APZ Digital Diagnostic SFP, 850 nm, 4.25/2.125/1.0625 GBd, RoHS Compliant Optical Transceiv.
Manufacture AVAGO
Datasheet
Download AFBR-57R5APZ Datasheet



AFBR-57R5APZ
AFBR-57R5APZ
Digital Diagnostic SFP, 850 nm, 4.25/2.125/1.0625 GBd,
RoHS Compliant Optical Transceiver
Data Sheet
PPOC-4102-DIAn8F252B01SRnCISN-mRN5GF:7LA(AJARP)JS0O5CE4LARR4AEP6PS0ZCRS4DO141D6C
Description
Avago’s AFBR-57R5APZ optical transceiver supports
high-speed serial links over multimode optical fiber at
signaling rates up to 4.25 Gb/s. Compliant with Small
Form Pluggable (SFP) Multi Source Agreement (MSA)
mechanical and electrical specifications for LC Duplex
transceivers, ANSI Fibre Channel FC-PI, FC-PI-2 and com-
patible with IEEE 802.3 for gigabit applications. The part
is electrically interoperable with SFP conformant devices.
As an enhancement to the conventional SFP interface
defined in SFF-8074i, the AFBR-57R5APZ is compliant to
SFF-8472 (digital diagnostic interface for optical trans-
ceivers). Using the 2-wire serial interface defined in the
SFF-8472 MSA, the AFBR-57R5APZ provides real time
temperature, supply voltage, laser bias current, laser
average output power and received input power. This
information is in addition to conventional SFP base data.
The digital diagnostic interface also adds the ability to
disable the transmitter (TX_DISABLE), monitor for Trans-
mitter Faults (TX_FAULT), and monitor for Receiver Loss
of Signal (RX_LOS).
Applications
Fibre channel systems
  – Director class switches
  – Fabric switches
  – HBA cards
Disk and tape drive arrays
Related Products
AFBR-59R5LZ: 850 nm +3.3 V LC SFF 2x7 for
4.25/2.125/1.0625 GBd Fibre Channel
Features
Fully RoHS Compliant
Diagnostic features per SFF-8472 “Diagnostic Moni-
toring Interface for Optical Transceivers”
Real time monitoring of:
– Transmitted optical power
– Received optical power
– Laser bias current
– Temperature
– Supply voltage
Wide temperature and supply voltage operation
(-10°C to 85°C) (3.3 V ± 10%)
Transceiver specifications per SFP (SFF-8074i) Multi-
Source Agree-ment and SFF-8472 (revision 9.3)
– 4.25 GBd Fibre Channel operation for
FC-PI 400-M5-SN-I and 400-M6-SN-I
– 2.125 GBd Fibre Channel operation for
FC-PI 200-M5-SN-I and 200-M6-SN-I
– 1.0625 GBd Fibre Channel operation for
FC-PI 100-M5-SN-I and 100-M6-SN-I
Link lengths at 4.25 GBd:
– 150 m with 50 µm MMF, 70 m with 62.5 µm MMF
Link lengths at 2.125 GBd:
– 300 m with 50 µm MMF, 150 m with 62.5 µm MMF
Link lengths at 1.0625 GBd:
– 500 m with 50 µm MMF, 300 m with 62.5 µm MMF
LC Duplex optical connector interface conforming to
ANSI TIA/EIA604-10 (FOCIS 10)
850 nm Vertical Cavity Surface Emitting Laser (VCSEL)
source technology
IEC 60825-1 Class 1/CDRH Class 1 laser eye safe
Compatible with Gigabit Ethernet
Patent - www.avagotech.com/patents



AFBR-57R5APZ
Installation
The AFBR-57R5APZ can be installed in any SFF-8074i
compliant Small Form Pluggable (SFP) port regardless of
host equipment operating status. The AFBR-57R5APZ is
hot-pluggable, allowing the module to be installed while
the host system is operating and on-line. Upon insertion,
the transceiver housing makes initial contact with the
host board SFP cage, mitigating potential damage due
to Electro-Static Discharge (ESD).
Digital Diagnostic Interface and Serial Identification
The 2-wire serial interface is based on ATMEL AT24C01A
series EEPROM protocol and signaling detail. Conven-
tional EEPROM memory, bytes 0-255 at memory address
0xA0, is organized in compliance with SFF-8074i. New
digital diag­nostic information, bytes 0-255 at memory
address 0xA2, is compliant to SFF-8472. The new diag-
nostic information provides the opportunity for Predic-
tive Failure Identification, Com­pliance Prediction, Fault
Isolation and Component Monitoring.
The I2C accessible memory page address 0xB0 is used
internally by SFP for the test and diagnostic purposes
and it is reserved.
Predictive Failure Identification
The AFBR-57R5APZ predictive failure feature allows a
host to identify potential link problems before system
performance is impacted. Prior identification of link
problems enables a host to service an application via
“fail over” to a redundant link or replace a suspect device,
maintaining system uptime in the process. For applica-
tions where ultra-high system uptime is required, a digital
SFP provides a means to monitor two real-time laser
metrics assoc­ iated with observing laser degradation and
predicting failure: average laser bias current (Tx_Bias) and
average laser optical power (Tx_Power).
Compliance Prediction
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFBR-57R5APZ devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify
potential component compliance issues. Received
optical power is also available to assess compliance of
a cable plant and remote transmitter. When operating
out of requirements, the link cannot guarantee error free
transmission.
Fault Isolation
The fault isolation feature allows a host to quickly
pinpoint the location of a link failure, minimizing
downtime. For optical links, the ability to identify a fault
at a local device, remote device or cable plant is crucial
to speeding service of an installation. AFBR-57R5APZ
real-time monitors of Tx_Bias, Tx_Power, Vcc, Temperature
and Rx_Power can be used to assess local transceiver
current operating conditions. In addition, status flags
Tx_Disable and Rx Loss of Signal (LOS) are mirrored in
memory and available via the two-wire serial interface.
Component Monitoring
Component evaluation is a more casual use of the
AFBR-57R5APZ real-time monitors of Tx_Bias, Tx_Power,
Vcc, Temperature and Rx_Power. Potential uses are as
debugging aids for system installation and design, and
transceiver parametric evaluation for factory or field
qualification. For example, temperature per module can
be observed in high density applications to facilitate
thermal evaluation of blades, PCI cards and systems.
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