Replaces March 1998 version, DS4084-2.3
APPLICATIONS s Rectification s Freewheel Diode s DC Motor Control s Power Supplies s Welding s Battery Chargers
FEATURES s High Surge Capability
VOLTAGE RATINGS
Type Number
Repetitive Peak
Reverse Voltage
V RRM V
SV10 25 M or K(R) SV10 20 M or K(R) SV10 16 M or K(R)
2500 2000 1600
Conditions
V = V + 100V
RSM
RRM
SV10
SV10
Rectifier Diode
DS4084-3.0 January 2000
KEY PARAMETERS
VRRM IF(AV) IFSM
2500V 180A
2200A
Lower voltage grades available. M for M12 thread. K for 1/2" - 20UNF thread, R for reverse polarity. Add C to type number for DO8C package.
CURRENT RATINGS
Outline type codes: DO8C and DO8. See Package Details for further information.
Symbol
Parameter
Single Side Cooled
IF(AV) IF(RMS)
IF
Mean forward current RMS value Continuous (direct) forward current
Conditions
Half wave resistive load, Tcase = 100oC Tcase = 100oC Tcase = 100oC
Max. Units
180 A 283 A 233 A
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SURGE RATINGS
Symbol
Parameter
I Surge (non-repetitive) forward current FSM I2t I2t for fusing
I Surge (non-repetitive) forward current FSM I2t I2t for fusing
Conditions 10ms half sine; T = 175oC
case
VR = 50% VRRM - 1/4 sine 10ms half sine; Tcase =175oC
VR = 0
Max. Units 1.76 kA 14.9 x 103 A2s 2.2 kA 24.0 x 103 A2s
THERMAL AND MECHANICAL DATA
Symbol
Parameter
Rth(j-c) Rth(c-h)
Thermal resistance - junction to case Thermal resistance - case to heatsink
T Virtual junction temperature vj
Tstg Storage temperature range - Mounting Torque
Conditions
dc Mounting torque 15.0Nm with mounting compound On-state (conducting)
Reverse (blocking)
Min. Max. Units - 0.23 oC/W - 0.08 oC/W
- 175 - 175 -55 200 12.0 15.0
oC oC oC Nm
CHARACTERISTICS
Symbol
Parameter
V Forward voltage FM
IRRM Peak reverse current QS Total stored charge IRM Peak recovery current trr reverse recovery time V Threshold voltage
TO
r Slope resistance T
*Typical values.
Conditions At 300A peak, T = 25oC
case
At VRRM, Tcase = 175oC
I
F
=
100A,
dI /dt RR
=
20A/µs,
T case
=
25˚C
At T = 175˚C vj
At T = 175˚C vj
Typ. Max. Units
- 1.5 V
300*
20 -
mA µC
100* -
A
6.5* -
µs
- 1.1 V
- 1.3 mΩ
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CURVES
SV10
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SV10
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SV10
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PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
Ø8.4 ± 0.3
8 min 20 max
Ø5.2 ± 0.2 12 ± 0.5
163 ± 10 Type No + K - 20.6 ± 0.6 Type No + M - 18.0 ± 0.5
60 max Type No + K - 20.6 ± 0.6 Type No + M - 18.0 ± 0.5
12 ± 0.5
Ø27 max
3.17 max
8 min
Thread M12 1/2" 20 UNF
Nominal weight: 120g Mounting torque: 15Nm ±10% Package outine type code: DO8
ASSOCIATED PUBLICATIONS
Title
Calculating the junction temperature or power semiconductors Thyristor and diode measurement with a multi-meter Use of V , r on-state characteristic
TO T
Ø27 max
3.17 max
8 min
Thread M12 1/2" 20 UNF
Nominal weight: 120g Mounting torque: 15Nm ±10%
Package outine type code: DO8C
Application Note Number AN4506 AN4853 AN5001
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POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory.
http://www.dynexsemi.com e-mail:
[email protected]
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550
DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER .