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SV1020KR Dataheets PDF



Part Number SV1020KR
Manufacturers Dynex Semiconductor
Logo Dynex Semiconductor
Description Rectifier Diode
Datasheet SV1020KR DatasheetSV1020KR Datasheet (PDF)

Replaces March 1998 version, DS4084-2.3 APPLICATIONS s Rectification s Freewheel Diode s DC Motor Control s Power Supplies s Welding s Battery Chargers FEATURES s High Surge Capability VOLTAGE RATINGS Type Number Repetitive Peak Reverse Voltage V RRM V SV10 25 M or K(R) SV10 20 M or K(R) SV10 16 M or K(R) 2500 2000 1600 Conditions V = V + 100V RSM RRM SV10 SV10 Rectifier Diode DS4084-3.0 January 2000 KEY PARAMETERS VRRM IF(AV) IFSM 2500V 180A 2200A Lower voltage grades available..

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Replaces March 1998 version, DS4084-2.3 APPLICATIONS s Rectification s Freewheel Diode s DC Motor Control s Power Supplies s Welding s Battery Chargers FEATURES s High Surge Capability VOLTAGE RATINGS Type Number Repetitive Peak Reverse Voltage V RRM V SV10 25 M or K(R) SV10 20 M or K(R) SV10 16 M or K(R) 2500 2000 1600 Conditions V = V + 100V RSM RRM SV10 SV10 Rectifier Diode DS4084-3.0 January 2000 KEY PARAMETERS VRRM IF(AV) IFSM 2500V 180A 2200A Lower voltage grades available. M for M12 thread. K for 1/2" - 20UNF thread, R for reverse polarity. Add C to type number for DO8C package. CURRENT RATINGS Outline type codes: DO8C and DO8. See Package Details for further information. Symbol Parameter Single Side Cooled IF(AV) IF(RMS) IF Mean forward current RMS value Continuous (direct) forward current Conditions Half wave resistive load, Tcase = 100oC Tcase = 100oC Tcase = 100oC Max. Units 180 A 283 A 233 A 1/7 SV10 SURGE RATINGS Symbol Parameter I Surge (non-repetitive) forward current FSM I2t I2t for fusing I Surge (non-repetitive) forward current FSM I2t I2t for fusing Conditions 10ms half sine; T = 175oC case VR = 50% VRRM - 1/4 sine 10ms half sine; Tcase =175oC VR = 0 Max. Units 1.76 kA 14.9 x 103 A2s 2.2 kA 24.0 x 103 A2s THERMAL AND MECHANICAL DATA Symbol Parameter Rth(j-c) Rth(c-h) Thermal resistance - junction to case Thermal resistance - case to heatsink T Virtual junction temperature vj Tstg Storage temperature range - Mounting Torque Conditions dc Mounting torque 15.0Nm with mounting compound On-state (conducting) Reverse (blocking) Min. Max. Units - 0.23 oC/W - 0.08 oC/W - 175 - 175 -55 200 12.0 15.0 oC oC oC Nm CHARACTERISTICS Symbol Parameter V Forward voltage FM IRRM Peak reverse current QS Total stored charge IRM Peak recovery current trr reverse recovery time V Threshold voltage TO r Slope resistance T *Typical values. Conditions At 300A peak, T = 25oC case At VRRM, Tcase = 175oC I F = 100A, dI /dt RR = 20A/µs, T case = 25˚C At T = 175˚C vj At T = 175˚C vj Typ. Max. Units - 1.5 V 300* 20 - mA µC 100* - A 6.5* - µs - 1.1 V - 1.3 mΩ 2/7 CURVES SV10 3/7 SV10 4/7 SV10 5/7 SV10 PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Ø8.4 ± 0.3 8 min 20 max Ø5.2 ± 0.2 12 ± 0.5 163 ± 10 Type No + K - 20.6 ± 0.6 Type No + M - 18.0 ± 0.5 60 max Type No + K - 20.6 ± 0.6 Type No + M - 18.0 ± 0.5 12 ± 0.5 Ø27 max 3.17 max 8 min Thread M12 1/2" 20 UNF Nominal weight: 120g Mounting torque: 15Nm ±10% Package outine type code: DO8 ASSOCIATED PUBLICATIONS Title Calculating the junction temperature or power semiconductors Thyristor and diode measurement with a multi-meter Use of V , r on-state characteristic TO T Ø27 max 3.17 max 8 min Thread M12 1/2" 20 UNF Nominal weight: 120g Mounting torque: 15Nm ±10% Package outine type code: DO8C Application Note Number AN4506 AN4853 AN5001 6/7 SV10 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839 HEATSINKS Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER .


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