High Density Dynamic RAM Module
HB56D136 Series
1,048,576-word × 36-bit High Density Dynamic RAM Module
ADE-203-209A (Z) Rev 1.0
Sept. 20, 1994
Descript...
Description
HB56D136 Series
1,048,576-word × 36-bit High Density Dynamic RAM Module
ADE-203-209A (Z) Rev 1.0
Sept. 20, 1994
Description
The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in SOJ package. An outline of the HB56D136 is 72-pin single in-line package.
Therefore, the HB56D136 makes high density mounting possible without surface mount technology. The HB56D136 provides common data inputs and outputs. Decoupling capacitors are mounted beneath each SOJ.
Features
72-pin — Lead pitch: 1.27 mm
Single 5 V (±5%) supply High speed
— Access time: 60 ns/70 ns/80 ns (max) Low power dissipation
— Active mode: 5.46 W/4.94 W/4.41 W (max) — Standby mode: 105 mW (max)
5.25 mW (max) (L-version) Fast page mode capability 1,024 refresh cycle: 16 ms
128 ms (L-version) 3 variations of refresh
— RAS only refresh — CAS-before-RAS refresh — Hidden refresh TTL compatible
HB56D136 Series
Ordering Information
Type No. HB56D136BW-6C HB56D136BW-7C HB56D136BW-8C HB56D136BW-6CL HB56D136BW-7CL HB56D136BW-8CL HB56D136SBW-6C HB56D136SBW-7C HB56D136SBW-8C HB56D136SBW-6CL HB56D136SBW-7CL HB56D136SBW-8CL
Access Time 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns
Package 72-pin SIP socket type
Contact Pad Gold
72-pin SIP socket type
Solder
2
Pin Arrangement
HB56D136 Series
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Pin Name VSS DQ0 DQ...
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