Document
Product Not Recommended For New Designs
1
R Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet
DS083 (v5.0) June 21, 2011
0
Product Specification
Module 1: Introduction and Overview
10 pages
• Summary of Features • General Description • Architecture • IP Core and Reference Support • Device/Package Combinations and Maximum I/O • Ordering Information
Module 2: Functional Description
60 pages
• Functional Description: RocketIO™ X Multi-Gigabit Transceiver
• Functional Description: RocketIO Multi-Gigabit Transceiver
• Functional Description: Processor Block • Functional Description: PowerPC™ 405 Core • Functional Description: FPGA
- Input/Output Blocks (IOBs) - Digitally Controlled Impedance (DCI) - On-Chip Differential Termination - Configurable Logic Blocks (CLBs) - 3-State Buffers - CLB/Slice Configurations - 18-Kb Block SelectRAM™ Resources - 18-Bit x 18-Bit Multipliers - Global Clock Multiplexer Buffers - Digital Clock Manager (DCM)
• Routing • Configuration
Module 3: DC and Switching Characteristics
59 pages
• Electrical Characteristics • Performance Characteristics • Switching Characteristics • Pin-to-Pin Output Parameter Guidelines • Pin-to-Pin Input Parameter Guidelines • DCM Timing Parameters • Source-Synchronous Switching Characteristics
Module 4: Pinout Information
302 pages
• Pin Definitions • Pinout Tables
- FG256/FGG256 Wire-Bond Fine-Pitch BGA Package - FG456/FGG456 Wire-Bond Fine-Pitch BGA Package - FG676/FGG676 Wire-Bond Fine-Pitch BGA Package - FF672 Flip-Chip Fine-Pitch BGA Package - FF896 Flip-Chip Fine-Pitch BGA Package - FF1148 Flip-Chip Fine-Pitch BGA Package - FF1152 Flip-Chip Fine-Pitch BGA Package - FF1517 Flip-Chip Fine-Pitch BGA Package - FF1696 Flip-Chip Fine-Pitch BGA Package - FF1704 Flip-Chip Fine-Pitch BGA Package
IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.
© 2000–2011 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. PowerPC is a trademark of IBM Corp. and is used under license. All other trademarks are the property of their respective owners.
DS083 (v5.0) June 21, 2011 Product Specification
www.xilinx.com
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Product Not Recommended For New Designs
1
R 0 Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Introduction and Overview
DS083 (v5.0) June 21, 2011
Product Specification
Summary of Virtex-II Pro™ / Virtex-II Pro X Features
• High-Performance Platform FPGA Solution, Including
- Up to twenty RocketIO™ or RocketIO X embedded Multi-Gigabit Transceivers (MGTs)
- Up to two IBM PowerPC™ RISC processor blocks • Based on Virtex-II™ Platform FPGA Technology
- Flexible logic resources - SRAM-based in-system configuration - Active Interconnect technology
- SelectRAM™+ memory hierarchy - Dedicated 18-bit x 18-bit multiplier blocks - Hig.