Document
IS1690S SoC
Bluetooth® 3.0 Multi-Speaker Stereo Audio SOC
Features
System Specification
Compliant with Bluetooth Specification v.3.0 + EDR in 2.4 GHz ISM band
It supports following profiles : - Hands Free 1.5 - Headset 1.0 - A2DP 1.0 - AVRCP 1.0
Baseband Hardware
16MHz main clock input Built-in internal ROM for program memory Support to connect to two hosts ( phones,
tablets…) with HFP or A2DP profiles simultaneously Adaptive Frequency Hopping (AFH) avoids occupied RF channels Fast Connection supported
RF Hardware
Fully Bluetooth 3.0 + EDR system in 2.4 GHz ISM band.
Combined TX/RX RF terminal simplifies external matching and reduces external antenna switches.
Max. +4dBm output power with 20 dB level control from register control.
Built-in T/R switch for Class 2/3 application To avoid temperature variation, temperature
sensor with temperature calibration is utilized into bias current and gain control. Fully integrated synthesizer has been created. There requires no external VCO, varactor diode, resonator and loop filter. Crystal oscillation with built-in digital trimming for temperature/process variations.
Audio processor Support A-Law or -Law PCM format, or CVSD
(Continuous Variable Slope Delta Modulation) for SCO channel operation. Noise suppression Echo suppression SBC decoding Packet loss concealment Build-in one languages (English) voice prompts and 20 events for each one Support SCMS-T
Audio Codec
16 bit DAC and 16 bit ADC codec 94dB SNR DAC playback 85 dB SNR ADC.
Peripherals
Built-in Lithium-ion battery charger (up to 350mA) Integrate 3V, 1.8V configurable switching regulator
and LDO Built-in ADC for battery monitor and voltage sense. A aux-in port for external audio input Two LED drivers
Flexible HCI interface
High speed HCI-UART (Universal Asynchronous Receiver Transmitter) interface (up to 921600bps)
Package
7x7mm2 56QFN package
Description
IS1690S multi-speaker stereo audio chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth v3.0 with Enhanced Data Rate 2.4GHz applications. This chip is fully compliant with Bluetooth specification and completely backwardcompatible with Bluetooth 2.0 or 1.2 systems.
It incorporates Bluetooth 1M/2M/3Mbps RF, singlecycle 8bit MCU, TX/RX modem, 5-port memory controller, task/hopping controller, UART interface, and ISSC’s own Bluetooth software stack to achieve the required BT v3.0 with EDR functions.
To provide the superior audio and voice quality, it also integrates a DSP co-processor, a PLL, and a CODEC dedicated for voice and audio applications.
For voice, not only basic CVSD encoding and decoding but also enhanced noise reduction and echo cancellation are implemented by the built-in DSP to achieve better quality in both sending and receiving sides. For the enhanced audio applications, SBC decoding functions can be also carried out by DSP to satisfy Bluetooth A2DP requirements.
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