multimedia SOC. SH86263 Datasheet

SH86263 SOC. Datasheet pdf. Equivalent

Part SH86263
Description single-chip highly integrated digital multimedia SOC
Feature SINO WEALTH SH86263 FEATURE DATASHEET Released Ver 1.0 August 19, 2009 INFORMATION IN THIS DOCUMENT .
Manufacture Sino
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SINO WEALTH SH86263 FEATURE DATASHEET Released Ver 1.0 Augus SH86263 Datasheet
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SH86263
SINO WEALTH
SH86263
FEATURE DATASHEET
Released
Ver 1.0
August 19, 2009
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SINO WEALTH PRODUCTS, AND
IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SINO
WEALTH PRODUCTS OR TECHNOLOGY.
ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE
OR WARRANTY OF ANY KIND.
SINO WEALTH ELECTRONIC RESERVES THE RIGHT TO CHANGE PRODUCTS OR SPECIFICATION
WITHOUT NOTICE.



SH86263
SINO WEALTH
SH86263 Feature
CONTENT
1. FEATURES ............................................................................................................................................................... 3
2. GENERAL DESCRIPTION ....................................................................................................................................... 3
3. PAD AND PIN ASSIGNMENT................................................................................................................................... 4
3.1. TQFP48 PIN OUT.............................................................................................................................................. 4
3.2. PAD AND PIN DESCRIPTION.................................................................................................................................. 5
4. ELECTRICAL SPECIFICATIONS ............................................................................................................................. 7
4.1. ABSOLUTE MAXIMUM RATINGS............................................................................................................................. 7
4.2. RECOMMENDED OPERATING CONDITIONS ............................................................................................................. 7
4.3. DC CHARACTERISTICS........................................................................................................................................ 7
5. PACKAGE OUTLINE INFORMATION ...................................................................................................................... 8
5.1. TQFP48 OUTLINE DIMENSIONS (FOR MAIN CHIP PACKAGE) ................................................................................... 8
6. HISTORY .................................................................................................................................................................. 8
2009/8/19 2/8 Ver 1.0





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