HEXFET
PD - 93812 PD - 93813
IIRRFF77880099//IIRRFF77881111
Provisional Datasheet
• N-Channel Application-Specific MOSFETs HEX...
Description
PD - 93812 PD - 93813
IIRRFF77880099//IIRRFF77881111
Provisional Datasheet
N-Channel Application-Specific MOSFETs HEXFET® Chipset for DC-DC Converters
Ideal for CPU Core DC-DC Converters
New CopperStrapTM Interconnect for Lower Electrical and Thermal Resistance
Low Conduction Losses
S1
AA 8D
Low Switching Losses
S2
7D
Minimizes Parallel MOSFETs for high current applications
S3
6D
G4
5D
Description
These new devices employ advanced HEXFET® Power
SO-8
Top View
MOSFET technology to achieve an unprecedented
balance of on-resistance and gate charge. The reduced
conduction and switching losses make them ideal for
high efficiency DC-DC converters that power the latest generation of mobile microprocessors.
DEVICE RATINGS
The IRF7809/IRF7811 employs a newCopperStrapTM interconnect technology pioneered by International
VDS
IRF7809 30V
IRF7811 28V
Rectifier to dramatically improve the electrial & thermal resistance contribution of the package. The new CopperStrap SO-8 power MOSFETs are capable of current ratings over 17A and power dissipation of 3.5W @ 25°C ambient conditions, thereby reducing the need for paralleled devices, improving efficiency and
RDS(on) QG Qsw Q
oss
7.5 mΩ 77.5 nC 23.9 nC 30 nC
11 mΩ 23 nC 7 nC 31 nC
reliability and reducing board space.
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain or Source
Current (VGS ≥ 4.5V) Pulsed Drain Current
T = 25°C A
TL = 90°C
Power Dissipati...
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