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FLASH MEMORY. W25Q40CL Datasheet

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FLASH MEMORY. W25Q40CL Datasheet






W25Q40CL MEMORY. Datasheet pdf. Equivalent




W25Q40CL MEMORY. Datasheet pdf. Equivalent





Part

W25Q40CL

Description

2.5/3/3.3V 4 M-BIT SERIAL FLASH MEMORY



Feature


W25Q40CL 2.5/3/3.3V 4 M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS, DUAL AND QUAD SPI -1- Publication Release Date: Oc tober 31, 2014 Revision D1 W25Q40CL T able of Contents 1. GENERAL DESCRIPTIO N ..................................... ....................................... ............................. 5 2. FEA TURES ................................. ...................
Manufacture

Winbond

Datasheet
Download W25Q40CL Datasheet


Winbond W25Q40CL

W25Q40CL; ........................................ ...................................... 5 3. PIN CONFIGURATION SOIC 150-MIL, V SOP 150-MIL, TSSOP 173-MIL ............ .................... 6 4. PAD CONFIGU RATION USON 2X3-MM .................... ....................................... ........................ 6 5. PIN DESC RIPTION SOIC 150-MIL .................. ...................


Winbond W25Q40CL

........................................ ................ 6 5.1 Package Types . ....................................... ....................................... ................................ 7 5.2 Chip Select (/CS) .................... ....................................... ....................................... .......... 7 5.3 Serial Data Input, Ou tput and IOs (DI, .


Winbond W25Q40CL

DO and IO0, IO1, IO2, IO3).............. ................. 7 5.4 Write Protect (/WP).................................. ....................................... ................................ 7 5.5 HOLD (/HOLD).......................... ....................................... ....................................... ........ 7 5.6 Serial Clock (CLK) .... ...................

Part

W25Q40CL

Description

2.5/3/3.3V 4 M-BIT SERIAL FLASH MEMORY



Feature


W25Q40CL 2.5/3/3.3V 4 M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS, DUAL AND QUAD SPI -1- Publication Release Date: Oc tober 31, 2014 Revision D1 W25Q40CL T able of Contents 1. GENERAL DESCRIPTIO N ..................................... ....................................... ............................. 5 2. FEA TURES ................................. ...................
Manufacture

Winbond

Datasheet
Download W25Q40CL Datasheet




 W25Q40CL
W25Q40CL
2.5/3/3.3V
4 M-BIT
SERIAL FLASH MEMORY WITH
4KB SECTORS, DUAL AND QUAD SPI
-1-
Publication Release Date: October 31, 2014
Revision D1




 W25Q40CL
W25Q40CL
Table of Contents
1. GENERAL DESCRIPTION ......................................................................................................... 5
2. FEATURES ................................................................................................................................. 5
3. PIN CONFIGURATION SOIC 150-MIL, VSOP 150-MIL, TSSOP 173-MIL ................................ 6
4.
PAD CONFIGURATION USON 2X3-MM ................................................................................... 6
5. PIN DESCRIPTION SOIC 150-MIL ............................................................................................ 6
5.1 Package Types ............................................................................................................... 7
5.2 Chip Select (/CS) ............................................................................................................ 7
5.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)............................... 7
5.4 Write Protect (/WP)......................................................................................................... 7
5.5 HOLD (/HOLD)................................................................................................................ 7
5.6 Serial Clock (CLK) .......................................................................................................... 7
6. BLOCK DIAGRAM ...................................................................................................................... 8
7. FUNCTIONAL DESCRIPTION.................................................................................................... 9
7.1 SPI OPERATIONS ......................................................................................................... 9
7.1.1 Standard SPI Instructions.................................................................................................9
7.1.2 Dual SPI Instructions ........................................................................................................9
7.1.3 Quad SPI Instructions.......................................................................................................9
7.1.4 Hold Function ...................................................................................................................9
7.2 WRITE PROTECTION.................................................................................................. 10
7.2.1 Write Protect Features....................................................................................................10
8. CONTROL AND STATUS REGISTERS................................................................................... 11
8.1 STATUS REGISTER .................................................................................................... 11
8.1.1 BUSY..............................................................................................................................11
8.1.2 Write Enable Latch (WEL) ..............................................................................................11
8.1.3 Block Protect Bits (BP2, BP1, BP0)................................................................................11
8.1.4 Top/Bottom Block Protect (TB).......................................................................................11
8.1.5 Sector/Block Protect (SEC) ............................................................................................11
8.1.6 Complement Protect (CMP) ...........................................................................................11
8.1.7 Status Register Protect (SRP1, SRP0)...........................................................................12
8.1.8 Erase/Program Suspend Status (SUS) ..........................................................................12
8.1.9 Security Register Lock Bits (LB3, LB2, LB1, LB0) ..........................................................12
8.1.10 Quad Enable (QE) ........................................................................................................13
8.1.11 Status Register Memory Protection (CMP = 0).............................................................14
8.1.12 Status Register Memory Protection (CMP = 1).............................................................15
9. INSTRUCTIONS ....................................................................................................................... 16
9.1.1 Manufacturer and Device Identification ..........................................................................16
9.1.2 Instruction Set Table 1 (Erase, Program Instructions) ....................................................17
9.1.3 Instruction Set Table 2 (Read Instructions) ....................................................................18
9.1.4 Instruction Set Table 3 (ID, Security Instructions) ..........................................................19
9.1.5 Write Enable (06h)..........................................................................................................20
9.1.6 Write Enable for Volatile Status Register (50h) ..............................................................20
9.1.7 Write Disable (04h).........................................................................................................21
9.1.8 Read Status Register-1 (05h) and Read Status Register-2 (35h) ..................................21
-2-
Publication Release Date: October 31, 2014
Revision D1




 W25Q40CL
W25Q40CL
9.1.9 Write Status Register (01h) ............................................................................................22
9.1.10 Read Data (03h) ...........................................................................................................23
9.1.11 Fast Read (0Bh) ...........................................................................................................24
9.1.12 Fast Read Dual Output (3Bh) .......................................................................................25
9.1.13 Fast Read Quad Output (6Bh)......................................................................................26
9.1.14 Fast Read Dual I/O (BBh).............................................................................................27
9.1.15 Fast Read Quad I/O (EBh) ...........................................................................................29
9.1.16 Set Burst with Wrap (77h) ............................................................................................31
9.1.17 Continuous Read Mode Bits (M7-0) .............................................................................32
9.1.18 Continuous Read Mode Reset (FFh or FFFFh) ............................................................32
9.1.19 Page Program (02h) .....................................................................................................33
9.1.20 Quad Input Page Program (32h) ..................................................................................34
9.1.21 Sector Erase (20h) .......................................................................................................35
9.1.22 32KB Block Erase (52h) ...............................................................................................36
9.1.23 64KB Block Erase (D8h)...............................................................................................37
9.1.24 Chip Erase (C7h / 60h).................................................................................................38
9.1.25 Erase / Program Suspend (75h) ...................................................................................39
9.1.26 Erase / Program Resume (7Ah) ...................................................................................40
9.1.27 Power-down (B9h)........................................................................................................41
9.1.28 Release Power-down / Device ID (ABh).......................................................................42
9.1.29 Read Manufacturer / Device ID (90h) ...........................................................................44
9.1.30 Read Manufacturer / Device ID Dual I/O (92h) .............................................................45
9.1.31 Read Manufacturer / Device ID Quad I/O (94h) ...........................................................46
9.1.32 Read Unique ID Number (4Bh) ....................................................................................47
9.1.33 Read JEDEC ID (9Fh) ..................................................................................................48
9.1.34 Read SFDP Register (5Ah) ..........................................................................................49
9.1.35 Erase Security Registers (44h).....................................................................................50
9.1.36 Program Security Registers (42h) ................................................................................51
9.1.37 Read Security Registers (48h) .....................................................................................52
10. ELECTRICAL CHARACTERISTICS ......................................................................................... 53
10.1 Absolute Maximum Ratings ........................................................................................ 53
10.2 Operating Ranges......................................................................................................... 53
10.3 Power-up Timing and Write Inhibit Threshold .............................................................. 54
10.4 DC Electrical Characteristics ........................................................................................ 55
10.5 AC Measurement Conditions........................................................................................ 56
10.6 AC Electrical Characteristics ........................................................................................ 57
AC Electrical Characteristics (cont’d)........................................................................................ 58
10.7 Serial Output Timing ..................................................................................................... 59
10.8 Serial Input Timing ........................................................................................................ 59
10.9 Hold Timing................................................................................................................... 59
10.10 WP Timing ................................................................................................................... 59
11. PACKAGE SPECIFICATION .................................................................................................... 60
11.1 8-Pin SOIC8 150-mil (Package Code SN).................................................................... 60
11.2 8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 61
11.3 8-Pad USON 2x3-mm (Package Code UX).................................................................. 62
-3-
Publication Release Date: October 31, 2014
Revision D1



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