Barrier Diode. SBAS70-04LT1G Datasheet

SBAS70-04LT1G Diode. Datasheet pdf. Equivalent

SBAS70-04LT1G Datasheet
Recommendation SBAS70-04LT1G Datasheet
Part SBAS70-04LT1G
Description Dual Series Schottky Barrier Diode
Feature SBAS70-04LT1G; BAS70-04LT1G, SBAS70-04LT1G Dual Series Schottky Barrier Diode These Schottky barrier diodes are de.
Manufacture ON Semiconductor
Datasheet
Download SBAS70-04LT1G Datasheet




ON Semiconductor SBAS70-04LT1G
BAS70-04LT1G,
SBAS70-04LT1G
Dual Series
Schottky Barrier Diode
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
Features
Extremely Fast Switching Speed
Low Forward Voltage
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
MAXIMUM RATINGS (TJ = 150°C unless otherwise noted)
Rating
Symbol
Value
Unit
Reverse Voltage
NonRepetitive Peak Forward
Surge Current (t 1.0 s)
VR 70 V
IFSM 100 mA
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Forward Power Dissipation
@ TA = 25°C
Derate above 25°C
PF
225 mW
1.8 mW/°C
Operating Junction and Storage
Temperature Range
TJ, Tstg 55 to +150
°C
Thermal Resistance
JunctiontoAmbient
RqJA
508
(Note 1)
311
(Note 2)
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR4 @ minimum pad.
2. FR4 @ 1.0 x 1.0 in pad.
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70 VOLTS SCHOTTKY
BARRIER DIODE
ANODE
1
CATHODE
2
3
CATHODE/ANODE
3
1
2
SOT23
(TO236AB)
CASE 318
MARKING DIAGRAM
CG M G
G
1
CG = Specific Device Code
M = Date Code*
G = PbFree Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping
BAS7004LT1G
SOT23
(PbFree)
3000 / Tape &
Reel
SBAS7004LT1G SOT23
(PbFree)
3000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
February, 2013 Rev. 10
1
Publication Order Number:
BAS7004LT1/D



ON Semiconductor SBAS70-04LT1G
BAS7004LT1G, SBAS7004LT1G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
Reverse Breakdown Voltage (IR = 10 μA)
Total Capacitance (VR = 0 V, f = 1.0 MHz)
Reverse Leakage (VR = 50 V)
(VR = 70 V)
V(BR)R
70
V
CT 2.0 pF
IR 0.1 μA
10
Forward Voltage (IF = 1.0 mA)
Forward Voltage (IF = 10 mA)
Forward Voltage (IF = 15 mA)
VF 410 mV
VF 750 mV
VF 1.0 V
100
10
1.0 150°C
1 25°C
85°C
- 40°C
25°C
0.1
- 55°C
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
VF, FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
100
TA = 150°C
10
125°C
1.0
85°C
0.1
0.01
25°C
0.001
0
5.0 10 15 20 25 30 35 40 45
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Reverse Current versus Reverse
Voltage
50
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0 5.0 10 15 20 25 30 35 40 45 50
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
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2



ON Semiconductor SBAS70-04LT1G
E
A
A1
D
3
12
e
BAS7004LT1G, SBAS7004LT1G
PACKAGE DIMENSIONS
HE
b
SOT23 (TO236)
CASE 31808
ISSUE AN
SEE VIEW C
c
0.25
q
L
L1
VIEW C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 31801 THRU 07 AND 09 OBSOLETE, NEW
STANDARD 31808.
MILLIMETERS
DIM MIN
NOM MAX
A 0.89
1.00
1.11
A1 0.01
0.06
0.10
b 0.37 0.44 0.50
c 0.09 0.13 0.18
D 2.80
2.90
3.04
E 1.20
1.30
1.40
e 1.78 1.90 2.04
L 0.10
0.20
0.30
L1 0.35
0.54
0.69
H E 2.10
2.40
2.64
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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BAS7004LT1/D







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