Single-Chip Microcontroller. UPD70F3370A Datasheet

UPD70F3370A Microcontroller. Datasheet pdf. Equivalent

UPD70F3370A Datasheet
Recommendation UPD70F3370A Datasheet
Part UPD70F3370A
Description 32-bit Single-Chip Microcontroller
Feature UPD70F3370A; Data Sheet V850ES/FE3 32-bit Single-Chip Microcontroller Hardware µPD70F3370A(A) µPD70F3371(A) µPD70.
Manufacture NEC
Download UPD70F3370A Datasheet

Data Sheet
32-bit Single-Chip Microcontroller
µPD70F3370A(A) µPD70F3371(A)
µPD70F3370A(A1) µPD70F3371(A1)
µPD70F3370A(A2) µPD70F3371(A2)
Document No. U18564EE1V2DS00
Date Published March 2008
© NEC Electronics 2008
Printed in Germany

Notes for CMOS Devices
1. Precaution against ESD for semiconductors
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2. Handling of unused input pins for CMOS
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to
the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3. Status before initialization of MOS devices
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not
guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset
signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
2 Data Sheet U18564EE1V2DS00

Legal Notes
• The information in this document is current as of January 2007. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that
may appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other
intellectual property rights of third parties by or arising from the use of NEC Electronics products
listed in this document or any other liability arising from the use of such NEC Electronics products.
No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual
property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for
illustrative purposes in semiconductor product operation and application examples. The incorporation
of these circuits, software and information in the design of customer's equipment shall be done under
the full responsibility of customer. NEC Electronics assumes no responsibility for any losses incurred
by customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics
products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated
entirely. To minimize risks of damage to property or injury (including death) to persons arising from
defects in NEC Electronics products, customers must incorporate sufficient safety measures in their
design, such as redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: “Standard”, “Special”
and “Specific”.
The "Specific" quality grade applies only to NEC Electronics products developed based on a
customer-designated “quality assurance program” for a specific application. The recommended
applications of NEC Electronics product depend on its quality grade, as indicated below. Customers
must check the quality grade of each NEC Electronics product before using it in a particular
Computers, office equipment, communications equipment, test and
measurement equipment, audio and visual equipment, home electronic
appliances, machine tools, personal electronic equipment and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control
systems, anti-disaster systems, anti-crime systems, safety equipment and
medical equipment (not specifically designed for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control
systems, life support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is “Standard” unless otherwise expressly specified in
NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products
in applications not intended by NEC Electronics, they must contact NEC Electronics sales
representative in advance to determine NEC Electronics 's willingness to support a given application.
Notes: 1.
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also
includes its majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC
Electronics (as defined above).
SuperFlash® is a registered trademark of Silicon Storage Technology, Inc. in several coun-
tries including the United States and Japan. This product uses SuperFlash® technology
licensed from Silicon Storage Technology, Inc.
Data Sheet U18564EE1V2DS00

@ 2014 :: :: Semiconductors datasheet search & download site (Privacy Policy & Contact)