Stacked Multi-Chip Product (MCP) Flash Memory/RAM
EN71NS032A0
EN71NS032A0 Stacked Multi-Chip Product (MCP) Flash Memory and RAM 32 Megabit (2M x 16-bit) CMOS 1.8 Volt-onl...
Description
EN71NS032A0
EN71NS032A0 Stacked Multi-Chip Product (MCP) Flash Memory and RAM 32 Megabit (2M x 16-bit) CMOS 1.8 Volt-only Burst Simultaneous Operation, Multiplexed Flash Memory and 16 Megabit (1M x 16-bit) Pseudo Static RAM
Distinctive Characteristics
MCP Features
■ Power supply voltage of 1.7V to 1.95V ■ High performance
- 70 ns @ random access - 7 ns @ burst access (108MHz)
■ Package - 6.2 x 7.7 x 1.0mm 56 ball BGA
■ Operating Temperature - 25°C to +85°C
General Description
EN71NS032A0 is a product line of stacked Multi-Chip Product (MCP) packages and consists of: ■ Burst Simultaneous Operation, Multiplexed NOR Flash Memory. ■ Burst Mode, Multiplexed Pseudo SRAM.
For detailed specifications, Please refer to the individual datasheets listed in the following table.
Device NOR Flash Memory Pseudo SRAM
Document EN29NS032 ENPSS16
Flash Density
Flash Access time Flash Burst mode max frequency Package
32Mb 70ns at Async. Mode 7ns at Burst Read 108MHz
56-ball BGA
pSRAM density
pSRAM Access time pSRAM Burst mode max frequency
16Mb
70ns at Async. Mode 7ns at Burst Read
108MHz
This Data Sheet may be revised by subsequent versions
1
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc., www.eonssi.com
Rev. B, Issue Date: 2011/07/05
MCP Block Diagram NOR FLASH + PSRAM DIAGRAM
EN71NS032A0
Note: Amax = A20
This Data Sheet may be revised by subsequent versions
2
or modifications due to changes in technical specifications.
©2004 ...
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