Document
LX3051 3 Gbs LX3050 10 Gbs LX3052 10Gbs 1x4 ARRAY InGaAs PIN PHOTODIODE
New Product Information and Sales Kit
Manufactured by: Microsemi Integrated Products
Garden Grove, CA
Telephone: 714-898-8121
More than solutions – enabling possibilities
WWW.Microsemi .COM
LX3050/1/2
InGaAs PIN PHOTODIODES
INTRODUCTION
CONFIDENTIAL INFORMATION This new product introduction guide is intended for use only by Microsemi’s sales people and authorized representatives and distributors. This material can be adapted for customer presentations, but the sales strategy and summary [pricing, availability, etc.] is confidential and should not be shown to customers
DESCRIPTION
Microsemi’s InGaAs Coplanar PIN Photodiode chips are ideal for high bandwidth 1310 and 1550 nm single-mode-fiber optical networking applications. The device family offers superior responsivity performance and high bandwidth with large active area in single die and 1x4 array die. The G-S-G coplanar waveguide allows very low cross-talk within the array. The LX305X family of photo diodes are currently offered in die form allowing manufacturers the versatility of custom assembly using either bond wire or flip chip configurations. This device is ideal for manufacturers of optical receivers, transceiver, transponders, optical transmission modules, and combination PIN photo diode – transimpedance amplifier.
SALES KIT
Copyright © 2001 Rev. 1.0 6/16/03
New Product Information and Sales Kit
Page 2
LX3050/1/2
InGaAs PIN PHOTODIODES
KEY PRODUCT INFORMATION
BLOCK DIAGRAM
LX3051
LX3050
WWW.Microsemi .COM
LX3052
KEY FEATURES
LX3051 single die, 3 Gbs, 80µm active area LX3050 single die, 10 Gbs, 32µm active area LX3052 1x4 array die, 10 Gbs, 32µm active area Coplanar Waveguide, 50 ohm characteristic impedance High Responsivity Low Dark Current High Bandwidth Anode/Cathode on illuminated Side 125µm Pad pitch Die good for bond wire or flip chip applications Die good for non-hermetic packaging (passed bare-die 85/85 test)
Copyright © 2001 Rev. 1.0 6/16/03
New Product Information and Sales Kit
Page 3
SALES KIT
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LX3050/1/2
InGaAs PIN PHOTODIODES
TYPICAL APPLICATION LX3051
• 3 Gigabit telecom, datacom, fibre channel, storage application. • SONET/SDH OC48/STM16 Connections • Internal Telecom and Datacom Switch/Router Connection • Any optical link over single-mode fiber at a maximum distance of 40km • Good for any data rate 1.25/2.5/3.125/ Gbps
TYPICAL APPLICATION LX3050
• 10 Gigabit Ethernet, telecom, datacom, fibre channel, storage application. • SONET/SDH OC192/STM64 Connections • Internal Telecom and Datacom Switch/Router Connection • Any optical link over single-mode fiber at a maximum distance of 40km • Good for any data rate 10 to12.5 Gbps
TYPICAL APPLICATION LX3052
• 4-channel parallel link to make 40 Gbs.
SALES KIT
Copyright © 2001 Rev. 1.0 6/16/03
New Product Information and Sales Kit
Page 4
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LX3050/1/2
InGaAs PIN PHOTODIODES
COMPETITIVE ANALYSIS
LX3051/LX3050/LX3052
Aperture Respon- Capacit
Dark
Competitor Device Diameter sivity
ance BW (GHz) Current
(µm) @1310(A/W) (pF)
(nA)
Notes
Microsemi LX3051
80
0.95 0.43 5.8 0.4
Optospeed
Luxnet XL Photonics Microsemi
PDCS75T D12A7060
LX3050
75 60 50 32
0.9 0.5 5.0 10
0.9 0.7 3.1 0.1
0.9 0.4 4 0.1
0.95
0.135
15.0
0.2
Emcore
8413-1150 32
0.9 0.18 15 0.5
Optospeed
Sumitomo XL Photonics Microsemi
PDCS32T F0900032
B
LX3052
32 30 20 32
0.9 0.15 15 10
0.9 0.20 10 0.2
0.9
0.18 17.7
0.1
0.95
0.135
15.0
0.2 Total 40 Gbs
None
Alternative Microsemi Solutions
SALES KIT
Device
Description
Notes
MXP4002 MXP4003
InGaAs PIN Photodiodes
• Anode on top, cathode bottom for the single 3Gbs PIN
InGaAs PIN Photodiodes
• Anode on top, cathode bottom for the single 10Gbs PIN
Copyright © 2001 Rev. 1.0 6/16/03
New Product Information and Sales Kit
Page 5
WWW.Microsemi .COM
LX3050/1/2
InGaAs PIN PHOTODIODES
SALES STRATEGY
Customers
Our customers make these products: photo-receiver, transceiver, and transponder. Most customers have their custom packages and want to buy bare PIN photodiode die. Customers are very technically oriented and need to work with Microsemi technical support.
Potential Customers
Vitesse DA Lightcom JDSU Ignis Optics Molex Luxtera Honeywell Lightron
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Copyright © 2001 Rev. 1.0 6/16/03
New Product Information and Sales Kit
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LX3050/1/2
Pricing
Device LX3051 LX3050 LX3052 Note:
InGaAs PIN PHOTODIODES
SUMMARY
Package
Die Die Die
Industrial (-20 to 85°C)
DC 1000+
$4.13
$5.07
$9.29
$13.93
$25.29
$37.94
Availability
Samples: Production:
Options
Now Now
Packages:
None
Temperature: C
Technical Support
Datasheet: Application Note: Evaluation Board:
Factory Contacts
Technical Questions: Marketing Manager:
Commercial -20 to 85
See Microsemi’s Website
See Datasheet N/A
Truc Vu (714) 372-8345 Paul Bibeau (714) 372-8046
SALES KIT
Copyright © 2001 Rev. 1.0.