MC4148

MC4148 / MCL4448 SMALL SIGNAL SWITCHING DIODE FEATURES ● Silicon epitaxial planar diode ● Fast switching diodes ● 500mw power dissipation ● High temperature soldering guaranteed 250℃/10S at terminals MECHANICAL DATA Case: MICRO MELF, Glass Terminals: Solderable per MIL-STD-750, Method 2026 Polarity : Color band denotes cathode end Mounting Position: Any Weight :0.011 grams MICRO-MELF .040(1.0) .048(1.2)DIA. .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in inches and (millimeters) Maximum Ratings ( TA=25 C Unless otherwise noted) PARAMETER Peak Reverse Voltage Maximum Average Forward Current at Ta=25 OC And f >50Hz Surge Forward Current at t < 1s and Tj= =25 OC Power Dissipation at Tamb= 25 OC Maximum Forward Voltage at IF =10mA Maximum Leakage Current at VR=20V at VR=75V at VR=20V ,TJ= 150OC Maximum Capacitance at VF =VR=0 Maximum Reverse Recovery Time From IF =-IR =10mA to IRR=-1mA ,VR=6V RL=100 Ω Typical Thermal Resistance Junction Temperature and Storage Temperature Range SYMBOL VRM IF (AV ) IF S M PTO T VF IR CJ trr RθJ A TJ,TS NOTE: 1. CJ at VR=0, f=1MHZ 2. From IF=10mA to IR=1mA, VR=6Volts, RL=100Ω MCL4148 / MCL4448 100 150 500 500 1.0 25 5 50 4 4 300 -65 to +175 UNITS V mA mA mW V nA µA µA pF ns OC / W OC P,POWER DISSIPATION,MILLIWATTS MCL4148 / MCL4448 RATINGS AND CHARACTERISTIC CURVES FIG. 1-ADMISSIBLE POWER DISSIPATION VERSUS AMBIENT TEMPERATURE 800 700 600 500 400 300 200 100 0 0 100 200℃ AMBIENT TEMPERATURE,℃ FIG. 3-FORWARD CHARACTER...