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CM6407 Dataheets PDF



Part Number CM6407
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description EMI Filters
Datasheet CM6407 DatasheetCM6407 Datasheet (PDF)

CM6407 EMI Filters with ESD Protection for Data Line Applications Product Description The CM6407 is an 18−bump EMI filter with ESD protection device for data line application in a 0.4 mm pitch, 5 x 4 CSP form factor. It is fully compliant with IEC 61000−4−2 Level 4. The CM6407 is RoHS II compliant. Features • 18−Bump, 1.96 mm X 1.56 mm Footprint Chip Scale Package • These Devices are Pb−Free and are RoHS Compliant http://onsemi.com WLCSP18 CASE 567CG ELECTRICAL SCHEMATIC I/O (1:7) RL I/O (.

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CM6407 EMI Filters with ESD Protection for Data Line Applications Product Description The CM6407 is an 18−bump EMI filter with ESD protection device for data line application in a 0.4 mm pitch, 5 x 4 CSP form factor. It is fully compliant with IEC 61000−4−2 Level 4. The CM6407 is RoHS II compliant. Features • 18−Bump, 1.96 mm X 1.56 mm Footprint Chip Scale Package • These Devices are Pb−Free and are RoHS Compliant http://onsemi.com WLCSP18 CASE 567CG ELECTRICAL SCHEMATIC I/O (1:7) RL I/O (1:7) Bottom Zener (Common to all Channels) MARKING DIAGRAM + 6407 YYWW XXXX 6407 YYWW XXXX = CM6407 = Date Code = Last four digits of lot# ORDERING INFORMATION Device Package Shipping† CM6407 CSP−18 (Pb−Free) 5000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 April, 2011 − Rev. 3 1 Publication Order Number: CM6407/D CM6407 Orientation Marking PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down View) Bottom View (Bumps Up View) + A1 Corner Indicator 6407 Table 1. PIN DESCRIPTIONS A5 = Line 1 A4 = Line 2 B5 = Line 3 C5 = Line 4 C4 = Line 5 D5 = Line 6 D4 = Line 7 A3 = GND B3 = GND C3 = GND D3 = GND A2 = Line 1 C2 = Line 4 D2 = Line 6 A1 = Line 2 B1 = Line 3 C1 = Line 5 D1 = Line 7 ELECTRICAL SPECIFICATIONS AND CONDITIONS Table 2. PARAMETERS AND OPERATING CONDITIONS Parameter Storage Temperature Range Operating Temperature Range Power Dissipation at 70°C per Channel Rating –55 to +150 –40 to +85 60 Units °C °C mW Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions R Resistance L Inductance (Note 2) C Capacitance per Channel Att(5) Passband Attenuation at 5 MHz At 1 MHz, VIN = 0 V At 1 MHz, VIN = 2.5 V FC VBR ILEAK VESD Cut−off Frequency Breakdown Voltage Leakage Current per Channel ESD Peak Discharge Voltage Protection at All Pins: a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard ZSOURCE = 50 W, ZLOAD = 50 W IR = ±1 mA VIN = 3.0 V (Note 2) 1. All parameters specified at TA = 25°C unless otherwise noted. 2. Standard IEC 61000−4−2 (CDischarge = 150 pF, RDischarge = 330 W). Min Typ Max Units 100 125 150 W 35 nH 19 24 29 pF 15 pF −7 dB 250 MHz ±6 ±7.8 ±10 V 10 100 nA kV ±15 ±15 http://onsemi.com 2 CM6407 RF CHARACTERISTICS Figure 1. Typical Insertion Loss (Bias = 0 V, TA = 255C, 50 W Environment) http://onsemi.com 3 CM6407 PACKAGE DIMENSIONS WLCSP18, 1.96x1.56 CASE 567CG−01 ISSUE O PIN A1 REFERENCE ÈÈ D 2X 0.05 C 2X 0.05 C 0.05 C TOP VIEW 0.05 C NOTE 3 A1 SIDE VIEW AB E A2 A C SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS DIM MIN MAX A 0.57 0.63 A1 0.17 0.24 A2 0.41 REF b 0.24 0.29 D 1.96 BSC E 1.56 BSC e 0.40 BSC RECOMMENDED SOLDERING FOOTPRINT* A1 PACKAGE OUTLINE 18 b 0.05 C A B 0.03 C D C e B A 123 4 5 BOTTOM VIEW e PI0T.C40H 0.40 PITCH 18X0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal .


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