Document
HSMP-389x Series, HSMP-489x Series Surface Mount RF PIN Switch Diodes
Data Sheet
GUx
Description/Applications
The HSMP-389x series is o ptimized for switching applications where low resistance at low current and low capacitance are required. The HSMP-489x series products feature ultra low parasitic inductance. These products are specifically designed for use at frequencies which are much higher than the upper limit for conventional PIN diodes.
Pin Connections and Package Marking
16 25
34
Notes: 1. Package marking provides orientation, identification, and date
code. 2. See “Electrical Specifications” for appropriate package marking.
Features
• Unique Configurations in Surface Mount Packages – Add Flexibility – Save Board Space – Reduce Cost • Switching – Low Capacitance – Low Resistance at Low Current • Low Failure in Time (FIT) Rate[1] • Matched Diodes for Consistent Performance • Better Thermal Conductivity for Higher Power
Dissipation • Lead-free
Note: 1. For more information see the Surface Mount PIN Reliability Data
Sheet.
Package Lead Code Identification, SOT-23/143 (Top View)
SINGLE
SERIES
#0 COMMON ANODE
#2 COMMON CATHODE
#3 UNCONNECTED
PAIR
#4 DUAL ANODE
#5 RING QUAD 34
4890
Package Lead Code Identification, SOT-323 (Top View)
SINGLE
SERIES
B COMMON ANODE
C COMMON CATHODE
E DUAL ANODE
F
489B
Package Lead Code Identification, SOT-363 (Top View)
UNCONNECTED TRIO
654
DUAL SWITCH MODEL
654
123 L
LOW INDUCTANCE
SINGLE 654
123 R
SERIES– SHUNT PAIR 654
123 T
HIGH FREQUENCY
SERIES 654
123 U
123 V
1 #7 2
UNDER DEVELOPMENT
Absolute Maximum Ratings[1] TC = +25°C Symbol Parameter
Unit
SOT-23/143 SOT-323/363
If Forward Current (1 µs Pulse) Amp
1 1
PIV Peak Inverse Voltage
V
100 100
Tj Junction Temperature
°C
150 150
Tstg Storage Temperature
°C
-65 to 150
-65 to 150
θjc Thermal Resistance[2] °C/W 500 150
Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.
2
Electrical Specifications, TC = 25°C, each diode
Part Number HSMP-
Package Marking Lead
Code Code Configuration
3890 3892 3893 3894 3895 389B 389C 389E 389F 389L 389R 389T 389U 389V
G0[1] G2[1] G3[1] G4[1] G5 [1] G0[2] G2[2] G3[2] G4[2] GL[2] S [2] Z[2] GU[2] GV[2]
0 Single 2 Series 3 Common Anode 4 Common Cathode 5 Unconnected Pair B Single C Series E Common Anode F Common Cathode L Unconnected Trio R Dual Switch Mode T Low Inductance Single U Series-Shunt Pair V High Frequency Series Pair
Test Conditions
Notes: 1. Package marking code is white. 2. Package is laser marked.
Minimum Breakdown Voltage VBR (V)
100
Maximum Series Resistance
RS (ý) 2.5
Maximum Total Capacitance
CT (pF) 0.30
MVeR a=sVuBrRe
f
=IF
= 5 mA 100 MHz
IR 10 µA
f
V=R
=5V 1 MHz
High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes
Part Package Number Marking
Minimum Breakdown
Voltage
HSMP- Code[1] Configuration VBR (V)
489x GA Dual Anode
100
Maximum Series
Resistance RS (ý) 2.5
Typical Total Capacitance C T (pF) 0.33
Maximum Typical
Total
Total
Capacitance Inductance
CT (pF)
LT (nH)
0.375
1.0
Test Conditions
VR = VBR IF = 5 mA
f = 1 MHz
VR = 5 V
Measure
VR = 5 V
f = 1 MHz
IR 10 µA
f=500 MHz– 3 GHz
Note:
1. SOT-23 package marking code is white; SOT-323 is laser marked.
Typical Parameters at TC = 25°C
Part Number HSMP-
389x Test Conditions
Series Resistance RS (ý)
3.8
f
=IF
= 1 mA 100 MHz
Carrier Lifetime τ (ns) 200
IFIR==160mmAA
Total Capacitance C T (pF)
0.20 @ 5V
3
HSMP-389x Series Typical Performance, TC = 25°C, each diode
100 0.55
0.50
TOTAL CAPACITANCE (pF)
RF RESISTANCE (OHMS)
10 0.45 0.40
1
0.1 0.01 0.1 1 10 100 IF – FORWARD BIAS CURRENT (mA)
Figure 1. Total RF Resistance at 25 C vs. Forward Bias Current.
0.35
0.30 1 MHz
0.25 0.20 0
1 GHz 48
12 16 20
VR – REVERSE VOLTAGE (V)
Figure 2. Capacitance vs. Reverse Voltage.
INPUT INTERCEPT POINT (dBm)
120 Diode Mounted as a 115 Series Attenuator in a
50 Ohm Microstrip and 110 Tested at 123 MHz 105 100 95 90 85
1 10 30 IF – FORWARD BIAS CURRENT (mA)
Figure 3. 2nd Harmonic Input Intercept Point vs. Forward Bias Current.
Trr – REVERSE RECOVERY TIME (nS)
200
160 VR = –2V
120
80 VR = –5V
40
VR = –10V 010 15 20 25
30
FORWARD CURRENT (mA)
Figure 4. Typical Reverse Recovery Time vs. Reverse Voltage.
IF – FORWARD CURRENT (mA)
100
10
1
0.1
0.01 0
125 C 25 C –50 C 0.2 0.4 0.6 0.8 1.0 1.2
VF – FORWARD VOLTAGE (V)
Figure 5. Forward Current vs. Forward Voltage.
Typical Applications for Multiple Diode Products
3.