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HSMP-389B Dataheets PDF



Part Number HSMP-389B
Manufacturers AVAGO
Logo AVAGO
Description Surface Mount RF PIN Switch Diodes
Datasheet HSMP-389B DatasheetHSMP-389B Datasheet (PDF)

HSMP-389x Series, HSMP-489x Series Surface Mount RF PIN Switch Diodes Data Sheet GUx Description/Applications The HSMP-389x series is o­ ptimized for switching applications where low resistance at low current and low capacitance are required. The HSMP-489x series products feature ultra low parasitic inductance. These products are specifically ­designed for use at frequencies which are much higher than the upper limit for conventional PIN diodes. Pin Connections and Package Marking 16 25 34 Not.

  HSMP-389B   HSMP-389B


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HSMP-389x Series, HSMP-489x Series Surface Mount RF PIN Switch Diodes Data Sheet GUx Description/Applications The HSMP-389x series is o­ ptimized for switching applications where low resistance at low current and low capacitance are required. The HSMP-489x series products feature ultra low parasitic inductance. These products are specifically ­designed for use at frequencies which are much higher than the upper limit for conventional PIN diodes. Pin Connections and Package Marking 16 25 34 Notes: 1. Package marking provides orientation, identification, and date code. 2. See “Electrical Specifications” for appropriate package marking. Features • Unique Configurations in Surface Mount Packages – Add Flexibility – Save Board Space – Reduce Cost • Switching – Low Capacitance – Low Resistance at Low Current • Low Failure in Time (FIT) Rate[1] • Matched Diodes for Consistent Performance • Better Thermal Conductivity for Higher Power Dissipation • Lead-free Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. Package Lead Code Identification, SOT-23/143 (Top View) SINGLE SERIES #0 COMMON ANODE #2 COMMON CATHODE #3 UNCONNECTED PAIR #4 DUAL ANODE #5 RING QUAD 34 4890 Package Lead Code Identification, SOT-323 (Top View) SINGLE SERIES B COMMON ANODE C COMMON CATHODE E DUAL ANODE F 489B Package Lead Code Identification, SOT-363 (Top View) UNCONNECTED TRIO 654 DUAL SWITCH MODEL 654 123 L LOW INDUCTANCE SINGLE 654 123 R SERIES– SHUNT PAIR 654 123 T HIGH FREQUENCY SERIES 654 123 U 123 V 1 #7 2 UNDER DEVELOPMENT Absolute Maximum Ratings[1] TC = +25°C Symbol Parameter Unit SOT-23/143 SOT-323/363 If Forward Current (1 µs Pulse) Amp 1 1 PIV Peak Inverse Voltage V 100 100 Tj Junction Temperature °C 150 150 Tstg Storage Temperature °C -65 to 150 -65 to 150 θjc Thermal Resistance[2] °C/W 500 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. 2 Electrical Specifications, TC = 25°C, each diode Part Number HSMP- Package Marking Lead Code Code Configuration 3890 3892 3893 3894 3895 389B 389C 389E 389F 389L 389R 389T 389U 389V G0[1] G2[1] G3[1] G4[1] G5 [1] G0[2] G2[2] G3[2] G4[2] GL[2] S [2] Z[2] GU[2] GV[2] 0 Single 2 Series 3 Common Anode 4 Common Cathode 5 Unconnected Pair B Single C Series E Common Anode F Common Cathode L Unconnected Trio R Dual Switch Mode T Low Inductance Single U Series-Shunt Pair V High Frequency Series Pair    Test Conditions Notes: 1. Package marking code is white. 2. Package is laser marked. Minimum Breakdown Voltage VBR (V) 100 Maximum Series Resistance RS (ý) 2.5 Maximum Total Capacitance CT (pF) 0.30 MVeR a=sVuBrRe f =IF = 5 mA 100 MHz IR ­10 µA f V=R =5V 1 MHz High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes Part Package Number Marking Minimum Breakdown Voltage HSMP- Code[1] Configuration VBR (V) 489x GA Dual Anode 100 Maximum Series Resistance RS (ý) 2.5 Typical Total Capacitance C T (pF) 0.33 Maximum Typical Total Total Capacitance Inductance CT (pF) LT (nH) 0.375 1.0   Test Conditions   VR = VBR IF = 5 mA f = 1 MHz VR = 5 V Measure VR = 5 V f = 1 MHz IR ­10 µA f=500 MHz– 3 GHz Note: 1. SOT-23 package marking code is white; SOT-323 is laser marked. Typical Parameters at TC = 25°C Part Number HSMP- 389x   Test Conditions   Series Resistance RS (ý) 3.8 f =IF = 1 mA 100 MHz Carrier Lifetime τ (ns) 200 IFIR==160mmAA Total Capacitance C T (pF) 0.20 @ 5V 3 HSMP-389x Series Typical Performance, TC = 25°C, each diode 100 0.55 0.50 TOTAL CAPACITANCE (pF) RF RESISTANCE (OHMS) 10 0.45 0.40 1 0.1 0.01 0.1 1 10 100 IF – FORWARD BIAS CURRENT (mA) Figure 1. Total RF Resistance at 25 C vs. Forward Bias Current. 0.35 0.30 1 MHz 0.25 0.20 0 1 GHz 48 12 16 20 VR – REVERSE VOLTAGE (V) Figure 2. Capacitance vs. Reverse Voltage. INPUT INTERCEPT POINT (dBm) 120 Diode Mounted as a 115 Series Attenuator in a 50 Ohm Microstrip and 110 Tested at 123 MHz 105 100 95 90 85 1 10 30 IF – FORWARD BIAS CURRENT (mA) Figure 3. 2nd Harmonic Input Intercept Point vs. Forward Bias Current. Trr – REVERSE RECOVERY TIME (nS) 200 160 VR = –2V 120 80 VR = –5V 40 VR = –10V 010 15 20 25 30 FORWARD CURRENT (mA) Figure 4. Typical Reverse Recovery Time vs. Reverse Voltage. IF – FORWARD CURRENT (mA) 100 10 1 0.1 0.01 0 125 C 25 C –50 C 0.2 0.4 0.6 0.8 1.0 1.2 VF – FORWARD VOLTAGE (V) Figure 5. Forward Current vs. Forward Voltage. Typical Applications for Multiple Diode Products 3.


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