Document
NICHIA STS-DA1-3168D
NICHIA CORPORATION SPECIFICATIONS FOR AMBER LED
NFSA172AT
● Pb-free Reflow Soldering Application ● Built-in ESD Protection Device ● RoHS Compliant ● TS16949 Compliant
SPECIFICATIONS
NICHIA STS-DA1-3168D
(1) Absolute Maximum Ratings
Item
Symbol
Absolute Maximum Rating
Forward Current
IF 250
Pulse Forward Current
IFP
350
Allowable Reverse Current
IR
85
Power Dissipation PD 825
Operating Temperature
Topr
-40~125
Storage Temperature
Tstg
-40~125
Junction Temperature
TJ
150
* Absolute Maximum Ratings at TS=25°C.
* IFP conditions with pulse width ≤10ms and duty cycle ≤10%.
Unit mA mA mA mW °C °C °C
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Condition
Typ
Max
Forward Voltage Luminous Flux
VF IF=150mA Φv IF=150mA
Chromaticity Coordinate
x y
- IF=150mA - IF=150mA
Thermal Resistance
RθJS_real RθJS_el
-
* Characteristics at TS=25°C.
* Luminous Flux value as per CIE 127:2007 standard.
3.0 27 0.57 0.42 24.6 19.8
32.0 25.7
* Chromaticity Coordinates as per CIE 1931 Chromaticity Chart.
* RθJS_real are decided by taking into account energy conversion efficiency. Please refer to JESD51.
Unit V lm -
°C/W °C/W
1
RANKS
Item Forward Voltage
Luminous Flux
Rank P11 P10 P9
Min 2.7 30.3 25.5 21.4
Max 3.3 36.0 30.3 25.5
Color Rank
Rank L3
x
0.576
0.549
0.562
0.589
y
0.407
0.425
0.438
0.411
* Ranking at TS=25°C. * Forward Voltage Tolerance: ±0.05V
* Luminous Flux Tolerance: ±7%
* Chromaticity Coordinate Tolerance: ±0.01
* LEDs from the above ranks will be shipped.
The rank combination ratio per shipment will be decided by Nichia.
NICHIA STS-DA1-3168D
Unit V lm
2
CHROMATICITY DIAGRAM
NICHIA STS-DA1-3168D
0.50 0.45 0.40 0.35
580 585 L3 590 595 600
y
0.30 0.45
0.50
0.55 x
0.60
0.65
3
OUTLINE DIMENSIONS
NICHIA STS-DA1-3168D
3 (2.3)
2.7 1
4
SOLDERING
NICHIA STS-DA1-3168D
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat 180 to 200°C
60sec Max Above 220°C
260°CMax 10sec Max
• Recommended Hand Soldering Condition
Temperature
350°C Max
Soldering Time
3sec Max
120sec Max
● Recommended Soldering Pad Pattern
3
* This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability. * Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once. * Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature. * Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere. * Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * When soldering, do not apply stress to the LED while the LED is hot. * When using a pick and place machine, choose an appropriate nozzle for this product. Using a pick-and-place nozzle with a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface and may also cause the LED not to illuminate. * The recommended soldering pad pattern is designed for attachment of the LED without problems. When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the LEDs. * Make sure that there are no issues with the type and amount of solder that is being used.
5
TAPE AND REEL DIMENSIONS
テーピング Tape
Φ 1.5+-00.1
4±0.1
2±0.05
Cathode Mark
1.75±0.1
NICHIA STS-DA1-3168D
0.2±0.05
Nxxx172x No. STS-DA7-0064C
( Unit: mm)
3.5±0.05 8 -+00..13
3.3±0.1
4±0.1
トレーラ/リーダ Trailer and Leader
Φ 1+-00.25 3.3±0.1
1.05±0.1
エンボスキャリアテープ Embossed Carrier Tape
トップカバーテープ Top Cover Tape
Φ 13 ±0.2 Φ 60 -+01
トレーラMIN 160mm() Trailer 160mm MIN (Empty Pockets)
リール Reel
180+-03
±0.8
21 Φ
f 21 ±0.8 f 13±0.2
ラベル Label
LED Loaded Pockets
きし Feed Direction
きしMIN 100mm() Leader with Top Cover Tape 100mm MIN (Empty Pocket)
リーダMIN 400mm Leader without Top Cover Tape 400mm MIN
11.4±1 9±0.3
* は1リールにつき 4000りです。 Reel Size: 4000pcs
* JIS C 0806テーピングにしています。
The tape packing method complies with JIS C 0806 (Packaging of Electronic Components on Continuous Tapes).
* の.