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BB156 Dataheets PDF



Part Number BB156
Manufacturers NXP
Logo NXP
Description Low-voltage variable capacitance diode
Datasheet BB156 DatasheetBB156 Datasheet (PDF)

DISCRETE SEMICONDUCTORS DATA SHEET BB156 Low-voltage variable capacitance diode Product specification Supersedes data of 1998 Aug 17 2004 Mar 01 NXP Semiconductors Low-voltage variable capacitance diode Product specification BB156 FEATURES  Excellent linearity  Very small plastic SMD package  C7.5: 4.8 pF; ratio 3.3  Very low series resistance. APPLICATIONS  Voltage controlled oscillators (VCO). DESCRIPTION The BB156 is a planar technology variable capacitance diode, in a SOD323 very .

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DISCRETE SEMICONDUCTORS DATA SHEET BB156 Low-voltage variable capacitance diode Product specification Supersedes data of 1998 Aug 17 2004 Mar 01 NXP Semiconductors Low-voltage variable capacitance diode Product specification BB156 FEATURES  Excellent linearity  Very small plastic SMD package  C7.5: 4.8 pF; ratio 3.3  Very low series resistance. APPLICATIONS  Voltage controlled oscillators (VCO). DESCRIPTION The BB156 is a planar technology variable capacitance diode, in a SOD323 very small plastic SMD package. PINNING PIN 1 2 cathode anode DESCRIPTION 12 sym008 Marking code: PF. The marking bar indicates the cathode. Fig.1 Simplified outline (SOD323; SC-76) and symbol. ORDERING INFORMATION TYPE NUMBER BB156 NAME  PACKAGE DESCRIPTION plastic surface mounted package; 2 leads LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VR IF Tstg Tj PARAMETER continuous reverse voltage continuous forward current storage temperature operating junction temperature VERSION SOD323 MIN.   55 55 MAX. UNIT 10 V 20 mA +150 C +125 C 2004 Mar 01 2 NXP Semiconductors Low-voltage variable capacitance diode ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL PARAMETER CONDITIONS IR rs Cd --C-----d------1----V----Cd 7.5 V reverse current diode series resistance diode capacitance capacitance ratio VR = 10 V; see Fig.3 VR = 10 V; Tj = 85 C; see Fig.3 f = 470 MHz; Cd = 9 pF f = 1 MHz; see Figs 2 and 4 VR = 1 V VR = 4 V VR = 7.5 V f = 1 MHz Product specification BB156 MIN. TYP. MAX. UNIT   10 nA   200 nA  0.4 0.7  14.4 7.6 4.2 2.7 16 8.6 4.8 3.3 17.6 9.6 5.4 3.9 pF pF pF 2004 Mar 01 3 NXP Semiconductors Low-voltage variable capacitance diode Product specification BB156 GRAPHICAL DATA 20 handbook, full pagewidth Cd (pF) 16 MGR466 12 8 4 0 10−1 f = 1 MHz; Tj = 25 C. 1 10 VR (V) Fig.2 Diode capacitance as a function of reverse voltage; typical values. 102 103 IR (nA) 102 10 mlc816 handboo1k0, 3 halfpage TC d (K−1) 10 4 MBH583 1 0 20 40 60 80 100 Tj (°C) Fig.3 Reverse current as a function of junction temperature; maximum values. 2004 Mar 01 10 5 10 1 1 10 VR (V) 102 Tj = 0 C to 85 C. Fig.4 Temperature coefficient of diode capacitance as a function of reverse voltage; typical values. 4 NXP Semiconductors Low-voltage variable capacitance diode PACKAGE OUTLINE Plastic surface-mounted package; 2 leads DA Product specification BB156 SOD323 E X HD v M A 1 (1) 2 bp A A1 detail X Q c Lp 01 scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E HD Lp Q v mm 1.1 0.8 0.05 0.40 0.25 0.25 0.10 1.8 1.6 1.35 1.15 2.7 2.3 0.45 0.25 0.15 0.15 0.2 Note 1. The marking bar indicates the cathode OUTLINE VERSION IEC REFERENCES JEDEC JEITA SOD323 SC-76 2 mm EUROPEAN PROJECTION ISSUE DATE 03-12-17 06-03-16 2004 Mar 01 5 NXP Semiconductors Low-voltage variable capacitance diode Product specification BB156 DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet PRODUCT STATUS(2) Development Qualification Production DEFINITION This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DEFINITIONS Product specification  The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. DISCLAIMERS Limited warranty and liability  Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for .


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