Power MOSFET
VDS RDS(on) max
(@VGS = -4.5V)
Qg (typical) ID
(@TA = 25°C)
-20 0.60 2.4 -0.78
V Ω nC A
IRLML6302PbF-1
HEXFET® Power ...
Description
VDS RDS(on) max
(@VGS = -4.5V)
Qg (typical) ID
(@TA = 25°C)
-20 0.60 2.4 -0.78
V Ω nC A
IRLML6302PbF-1
HEXFET® Power MOSFET
G1 S2
3D
Micro3TM
Features Industry-standard pinout SOT-23 Package
Compatible with Existing Surface Mount Techniques RoHS Compliant, Halogen-Free MSL1, Industrial qualification
Benefits ⇒ Multi-Vendor Compatibility
Easier Manufacturing Environmentally Friendlier Increased Reliability
Base Part Number IRLML6302TRPbF-1
Package Type Micro3™ (SOT-23)
Standard Pack
Form
Quantity
Tape and Reel
3000
Orderable Part Number IRLML6302TRPbF-1
Absolute Maximum Ratings
ID @ TA = 25°C ID @ TA = 70°C IDM PD @TA = 25°C
VGS dv/dt TJ, TSTG
Parameter Continuous Drain Current, VGS @ -4.5V Continuous Drain Current, VGS @ -4.5V Pulsed Drain Current Power Dissipation Linear Derating Factor Gate-to-Source Voltage Peak Diode Recovery dv/dt Junction and Storage Temperature Range
Thermal Resistance
Parameter RθJA Maximum Junction-to-Ambient
Max. -0.78 -0.62 -4.9 540 4.3 ± 12 -5.0 -55 to + 150
Units
A
mW mW/°C
V V/ns °C
Typ.
Max. 230
Units °C/W
1 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback
October 28, 2014
IRLML6302PbF-1
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage
-20 V VGS = 0V, ID = -250µA
ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient -4.9 mV/°C Reference to 25°C, ID = -1mA
RDS(ON)
S...
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