IGBT
IGC109T120T6RH
IGBT4 High Power Chip
Features: • 1200V Trench + Field stop technology • low VCE(sat) • soft turn off • ...
Description
IGC109T120T6RH
IGBT4 High Power Chip
Features: 1200V Trench + Field stop technology low VCE(sat) soft turn off positive temperature coefficient easy paralleling
This chip is used for: medium / high power modules
Applications: medium / high power drives
C G
E
Chip Type
VCE ICn
Die Size
IGC109T120T6RH 1200V 110A 7.48 x 14.61 mm2
Package sawn on foil
MECHANICAL PARAMETER Raster size Emitter pad size (incl. gate pad) Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Pad metal
Backside metal
Die bond Wire bond Reject ink dot size
Recommended storage environment
7.48 x 14.61
4 x (2.761 x 6.458) 0.811 x 1.31
mm 2
109.3 / 82.6
140 µm
150 mm
90 grd
126
Photoimide
3200 nm AlSiCu
Ni Ag –system suitable for epoxy and soft solder die bonding
Electrically conductive glue or solder
Al, <500µm
∅ 0.65mm ; max 1.2mm
Store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C
Edited by IN FINEON Technologies , AIM PMD D CID CLS , L7742 A, Edition 1, 31.10 .2007
MAXIMUM RATINGS Parameter
IGC109T120T6RH
Symbol
Value
Unit
Collector-Emitter voltage , Tj=25 °C DC collector current, limited by Tjmax
VC E IC
1200
1)
V A
Pulsed collector current, tp limited by Tjmax
Ic p u l s
330 A
Gate -Emitter voltage
VGE
±20 V
Operating junction temperature Short circuit data 2 ) V GE = 15V, VCC = 800V, Tvj = 150°C
Tj tp
-40 ... +175 10
°C µs
Reverse bias safe ...
Similar Datasheet
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