IGBT
IGC89T170S8RM
IGBT3 Power Chip
Features: 1700V Trench + Field stop technology low switching losses soft turn off ...
Description
IGC89T170S8RM
IGBT3 Power Chip
Features: 1700V Trench + Field stop technology low switching losses soft turn off positive temperature coefficient easy paralleling
This chip is used for: power modules
Applications: drives
Chip Type
VCE
IC
IGC89T170S8RM 1700V 75A
Die Size 8.85 x 10.09 mm2
C
G E
Package sawn on foil
Mechanical Parameters Raster size Emitter pad size (incl. gate pad) Gate pad size Area total Thickness Wafer size Max.possible chips per wafer Passivation frontside Pad metal
Backside metal
Die bond Wire bond Reject ink dot size
Recommended storage environment
8.85 x 10.09
6.634 x 7.874 1.674 x 0.899
mm2
89.3
190 µm
200 mm
280
Photoimide
3200 nm AlSiCu
Ni Ag –system suitable for epoxy and soft solder die bonding
Electrically conductive glue or solder
Al, <500µm
0.65mm ; max 1.2mm
Store in original container, in dry nitrogen, in dark environment, < 6 month at an ambient temperature of 23°C
Edited by INFINEON Technologies, IFAG IPC TD VLS, L7773O, L7773T, L7773E, Edition 0.9, 27.06.2014
IGC89T170S8RM
Maximum Ratings Parameter
Symbol
Value
Unit
Collector-Emitter voltage, Tvj =25 C DC collector current, limited by Tvj max
VCE IC
1700
1)
V A
Pulsed collector current, tp limited by Tvj max
Ic,puls
225 A
Gate emitter voltage
VGE
20 V
Junction temperature range Operating junction temperature Short circuit data 2 ) VGE = 15V, VCC = 1000V, Tvj = 150°C
Tvj Tvj tSC
-40 ... +175 -40...+150
10
°C C µs
Reverse bias safe o...
Similar Datasheet
- IGC89T170S8RM IGBT - Infineon