IGBT
IGC70T120T6RL
IGBT4 Low Power Chip
FEATURES: • 1200V Trench + Field Stop technology • low switching losses • positive ...
Description
IGC70T120T6RL
IGBT4 Low Power Chip
FEATURES: 1200V Trench + Field Stop technology low switching losses positive temperature coefficient easy paralleling
This chip is used for: low / medium power modules
Applications: low / medium power drives
C G
E
Chip Type
VCE ICn
IGC70T120T6RL 1200V 75A
Die Size 9.12 x 7.71 mm2
Package sawn on foil
MECHANICAL PARAMETER Raster size Emitter pad size (incl. gate pad) Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Pad metal
Backside metal
Die bond Wire bond Reject ink dot size
Recommended storage environment
9.12 x 7.71
7.61 x 6.24 1.31 x 0.81
mm 2
70.3 / 51.6
115 µm
150 mm
90 grd
200
Photoimide
3200 nm AlSiCu
Ni Ag –system suitable for epoxy and soft solder die bonding
Electrically conductive glue or solder
Al, <500µm
∅ 0.65mm ; max 1.2mm
Store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C
Edited by IN FINEON Technologies , AIM PMD D CID CLS , L7673C, Edition 1, 31.10.2007
MAXIMUM RATINGS Parameter
IGC70T120T6RL
Symbol
Value
Unit
Collector-Emitter voltage , Tj=25 °C DC collector current, limited by Tjmax
VC E IC
1200
1)
V A
Pulsed collector current, tp limited by Tjmax
Ic p u l s
225 A
Gate -Emitter voltage
VGE
±20 V
Operating junction temperature Short circuit data 2 ) V GE = 15V, VCC = 800V, Tvj = 150°C
Tj tp
-40 ... +175 10
°C µs
Reverse bias safe operating area 2 ) (RBSOA) 1...
Similar Datasheet
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