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ESD3V3XU1BL Dataheets PDF



Part Number ESD3V3XU1BL
Manufacturers Infineon
Logo Infineon
Description TVS Diode
Datasheet ESD3V3XU1BL DatasheetESD3V3XU1BL Datasheet (PDF)

TVS Diode Transient Voltage Suppressor Diodes ESD3V3XU1BL Bi-directional Ultra Low Capacitance ESD / Transient Protection Diode ESD3V3XU1BL Data Sheet Revision 1.3, 2013-09-11 Final Power Management & Multimarket Edition 2013-09-11 Published by Infineon Technologies AG 81726 Munich, Germany © 2013 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any.

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TVS Diode Transient Voltage Suppressor Diodes ESD3V3XU1BL Bi-directional Ultra Low Capacitance ESD / Transient Protection Diode ESD3V3XU1BL Data Sheet Revision 1.3, 2013-09-11 Final Power Management & Multimarket Edition 2013-09-11 Published by Infineon Technologies AG 81726 Munich, Germany © 2013 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. ESD3V3XU1BL Revision History: Revision 1.2, 2013-02-06 Page or Item Subjects (major changes since previous revision) Revision 1.3, 2013-09-11 5-6 Updated of Table 2-1, Table 2-2, Table 2-3 and Table 2-4 Trademarks of Infineon Technologies AG AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-10-26 Final Data Sheet 3 Revision 1.3, 2013-09-11 ESD3V3XU1BL Bi-directional Ultra Low Capacitance ESD / Transient Protection Diode 1 Bi-directional Ultra Low Capacitance ESD / Transient Protection Diode 1.1 Features • ESD / transient protection of high speed data lines exceeding – IEC61000-4-2 (ESD): ±20 kV (air / contact) – IEC61000-4-4 (EFT): ±2.5 kV / ±50 A (5/50 ns) – IEC61000-4-5 (surge): ±3 A (8/20 μs) • Maximum working voltage: VRWM = ±3.6 V • Ultra low capacitance CL = 0.20 pF (typical) at f = 1 GHz • Very low clamping voltage: VCL = 14 V at ITLP = 16 A (typical) according to TLP [1] • Very low dynamic resistance: RDYN = 0.45 Ω (typical) • Pb-free and halogen-free package (RoHS compliant) 1.2 Application Examples • USB 3.0, Firewire, DVI, HDMI, S-ATA, DisplayPort, Thunderbolt • Mobile HDMI Link, MDDI, MIPI, SWP / NFC 1.3 Product De.


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