SIGC158T170R3E

SIGC158T170R3E IGBT3 Power Chip Features:  1700V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling This chip is used for:  power modules Applications:  drives Chip Type VCE IC Die Size SIGC158T170R3E 1700V 125A 12.57 x 12.57 mm2 C G E Package sawn on foil Mechanical Parameters Raster size Emitter pad size (incl. gate pad) Gate pad size Area total Thickness Wafer size Max.possible chips per wafer Passivation frontside Pad metal Backside metal Die bond Wire bond Reject ink dot size Recommended storage environment 12.57 x 12.57 4 x ( 5.05 x 2.32 ) 4 x ( 5.05 x 2.54 ) 1.12 x 1.12 mm2 158 190 µm 200 mm 159 Photoimide 3200 nm AlSiCu Ni Ag –system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, <500µm  0.65mm ; max 1.2mm Store in original container, in dry nitrogen, in dark environment, < 6 month at an ambient temperature of 23°C Edited by INFINEON Technologies, IFAG IPC TD VLS, L7801M, L7801T, L7801E, Rev 2.2, 01.07.2014 SIGC158T170R3E Maximum Ratings Parameter Symbol Value Unit Collector-Emitter voltage, Tvj =25 C DC collector current, limited by Tvj max VCE IC 1700 1) V A Pulsed collector current, tp limited by Tvj max Ic,puls 375 A Gate emitter voltage VGE 20 V Junction temperature range Operating junction temperature Short circuit data 2 ) VGE = 15V, VCC = 1000V, Tvj = 150°C Tvj Tvj tSC -40 ... +175 -40...+150 10 ...