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STESD05 Dataheets PDF



Part Number STESD05
Manufacturers SeCoS
Logo SeCoS
Description Plastic Encapsulate ESD Protection Diodes
Datasheet STESD05 DatasheetSTESD05 Datasheet (PDF)

Elektronische Bauelemente STESD05 Plastic Encapsulate ESD Protection Diodes DESCRIPTION RoHS Compliant Product A suffix of “-HF” specifies halogen & lead-free The STESD05 is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in cellular phones, MP3 players, digital cameras and many other portable applic.

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Elektronische Bauelemente STESD05 Plastic Encapsulate ESD Protection Diodes DESCRIPTION RoHS Compliant Product A suffix of “-HF” specifies halogen & lead-free The STESD05 is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in cellular phones, MP3 players, digital cameras and many other portable applications where board space is at a premium. APPLICATIONS  Stand-off voltage: 5V  Low Leakage  Response Ttime is Typically < 1 ns  ESD Rating of Class 3 (>16kV) per Human Body Model  IEC61000-4-2 level 4 ESD protection  These are Pb-Free Devices DEVICE MARKING: B MAXIMUM RATINGS (TA = 25°C ) PARAMETER SYMBOL VALUE UNIT IEC 61000-4-2 (ESD) Contact ±30 KV ESD voltage Per Human Body Model 16 KV Per Machine Model 400 V Total power dissipation on FR-5 Board (Note 1) PD 100 mW Thermal Resistance Junction−to−Ambient RθJA 1250 °C / W Junction and Storage Temperature Range TJ, TSTG -55 ~ +150 °C Lead Solder Temperature – Maximum (10 Second Duration) TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended. Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-5 = 1.0 x 0.75 x 0.62 in. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted. VF = 0.9V max at IF = 10mA for all types) PARAMETER SYMBOL Working Peak Reverse Voltage VRWM Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT (Note2) Test Current Maximum Reverse Peak Pulse Current (Note3) Clamping Voltage @ IPP (Note3) Peak Power Dissipation (8 X 20 μs) Max. Capacitance @ VR =0 and f =1MHz IR VBR IT IPP VC PPK C 2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C. 3. Surge current waveform per Figure 3. http://www.SeCoSGmbH.com/ MIN - 6.2 - TYP - 107 65 MAX 5.0 1.0 7.3 1.0 8.7 12.3 - UNIT V μA V mA A V W pF Any changes of specification will not be informed individually. 06-Nov-2013 Rev. B Page 1 of 2 Elektronische Bauelemente CHARACTERISTICS CURVES STESD05 Plastic Encapsulate ESD Protection Diodes http://www.SeCoSGmbH.com/ 06-Nov-2013 Rev. B Any changes of specification will not be informed individually. Page 2 of 2 .


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