Document
LESHAN RADIO COMPANY, LTD.
Surface Mount Schottky Diode
z Applications Low current rectification
z Features 1) Small surface mounting type. 2) High reliability.
We declare that the material of product compliance with RoHS requirements.
S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable.
z Construction Silicon epitaxial planar
zDevice marking and ordering information
Device
LRB501V-40T1G S-LRB501V-40T1G
LRB501V-40T3G S-LRB501V-40T3G
Marking 4
4
Shipping 3000/Tape&Reel
10000/Tape&Reel
LRB501V-40T1G S-LRB501V-40T1G
1
SOD-323
2
1 CATHODE
2 ANODE
zAbsolute maximum ratings (Ta = 25°C)
Parameter Peak reverse voltage DC reverse voltage Mean rectifying current Peak forward surge current∗ Junction temperature Storage temperature
Symbol VRM VR IO IFSM Tj Tstg
Power Dissipation
∗ 60 Hz for 1
PD
Limits 45 40 0.1 1 125
−40~+125 200
Unit V V A A °C °C mW
zElectrical characteristics (Ta = 25°C)
Parameter
Symbol
Forward voltage
VF1
Forward voltage
VF2
Reverse current
IR
Capacitance between terminals CT
Note) ESD sensitive product handling required.
Min. − − − −
Typ. − − − 6.0
Max. 0.55 0.34 30
−
Unit Conditions V IF=100mA V IF=10mA µA VR=10V pF VR=10V, f=1MHz
Rev.O 1/3
LESHAN RADIO COMPANY, LTD. LRB501V-40T1G , S-LRB501V-40T1G
zElectrical characteristic curves (Ta = 25°C)
1000
10m
1m
100 100µ
125°C 75°C
FORWARD CURRENT : IF (mA) 125°C 75°C
25°C −25°C
REVERSE CURRENT : R (A)
10µ 25°C 10
1µ
1 0 0.1 0.2 0.3 0.4 0.5 0.6 FORWARD VOLTAGE : VF (V)
Fig. 1 Forward characteristics
0.1 µ 0
10 20 30 REVERSE VOLTAGE : VR (V)
40
Fig. 2 Reverse characteristics
CAPACITANCE BETWEEN TERMINALS : CT (pF)
100
10
1 0 5 10 15 20 25 30 35 REVERSE VOLTAGE : VR (V)
Fig. 3 Capacitance between terminals characteristics
Io CURRENT (%)
100 80 60 40 20 0 0 25 50 75 100 125 AMBIENT TEMPERATURE : Ta (°C)
Fig. 4 Derating curve
Rev.O 2/3
LESHAN RADIO COMPANY, LTD. LRB501V-40T1G , S-LRB501V-40T1G
SOD-323
HE D
b1
2E
C
NOTE 3
L
NOTE 5
A1
A3 A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS.
MILLIMETERS
DIM MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 L 0.08 HE 2.30 2.50 2.70
INCHES
MIN NOM MAX 0.031 0.035 0.040 0.000 0.002 0.004
0.006 REF 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105
SOLDERING FOOTPRINT*
0.63 0.025
1.60 0.063 2.85 0.112
0.83 0.033
Rev.O 3/3
.