CYStech Electronics Corp.
Spec. No. : C814S6R Issued Date : 2012.05.15 Revised Date : 2014.04.15 Page No. : 1/ 8
N-CHA...
CYStech Electronics Corp.
Spec. No. : C814S6R Issued Date : 2012.05.15 Revised Date : 2014.04.15 Page No. : 1/ 8
N-CHANNEL MOSFET (dual
transistors)
MTDN6303S6R
BVDSS ID
RDSON@VGS=4.5V, ID=600mA
RDSON@VGS=2.5V, ID=400mA
Features
RDSON@VGS=1.8V, ID=350mA
Low on-resistance
High ESD capability
High speed switching
Low-voltage drive(1.8V)
Pb-free lead plating and halogen-free package
20V 760mA 370mΩ(typ)
500mΩ(typ)
1.1Ω (typ)
Equivalent Circuit
MTDN6303S6R
Outline
SOT-363
Tr1 Tr2
The following characteristics apply to both Tr1 and Tr2
Absolute Maximum Ratings (Ta=25°C)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current @ TA=25°C, VGS=4.5V (Note 3)
Continuous Drain Current @ TA=85°C, VGS=4.5V (Note 3) Pulsed Drain Current (Notes 1, 2)
Maximum Power Dissipation
(Note 3)
TA=25℃ TA=85℃
ESD susceptibility
Operating Junction and Storage Temperature
Symbol VDS VGS ID IDM PD
Tj, Tstg
Note : 1. Pulse width limited by maximum junction temperature. 2. Pulse width≤ 300μs, duty cycle≤2%. 3.Surface mounted on 1 in² copper pad of FR-4 board, t≤5s.
4.Human body model, 1.5kΩ in series with 100pF
MTDN6303S6R
Limits 20 ±8 760 550 3 300
160
2000 (Note 4) -55~+150
Unit V
mA A mW
V °C
CYStek Product Specification
CYStech Electronics Corp.
Thermal Performance
Parameter Thermal Resistance, Junction-to-Ambient(PCB mounted) (Note)
Note : Surface mounted on 1 in² copper pad of FR-4 board, t≤5s.
Symbol Rth,ja
Spec. No. : C814S6R Issued Da...