Document
Transient Voltage Suppression Diodes
Surface Mount – 1000W > 1KSMB series
1KSMB Series
RoHS
Pb e3
Uni-directional
Bi-directional
Agency Approvals
AGENCY
AGENCY FILE NUMBER E230531
Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted)
Parameter
Symbol
Peak Pulse Power Dissipation at
(TFAi=g2.25)º(NCobtye
10/1000µs Waveform 1), (Note 2)
Power Dissipation on Infinite Heat Sink at TL=50OC Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) Maximum Instantaneous Forward Voltage at 50A for Unidirectional Only Operating Temperature Range
Storage Temperature Range
Typical Thermal Resistance Junction to Lead
PPPM
PD IFSM
VF TJ TSTG RθJL
Typical Thermal Resistance Junction to Ambient
RθJA
Value 1000
5.0 120
3.5 -65 to 150 -65 to 175
20 100
Unit W
W A
V °C °C
°C/W
°C/W
Notes: 1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3.
2. Mounted on copper pad area of 0.2x0.2” (5.0 x 5.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum.
Functional Diagram
Cathode
Bi-directional Uni-directional
Anode
Description
The 1KSMB series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.
Features
• 1000W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
• For surface mounted applications to optimize board space
• Low profile package
• Typical failure mode is short from over-specified voltage or current
• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
• IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
• ESD protection of data lines in accordance with IEC 61000-4-2
• EFT protection of data lines in accordance with IEC 61000-4-4
• Built-in strain relief
• xV(αB(R1T:+@TαeTmTJ=pxeV(rBTaRJt@u-2r2e55°)C) Coefficient, typical value is 0.1%)
• Glass passivated chip junction
• Fast response time: typically less than 1.0ps from 0V to BV min
• Excellent clamping capability
• Low incremental surge resistance
•
wTyhpeicnaVl IBRR
less than 1μA max>12V
• High temperature
to reflow soldering
guaranteed: 260°C/40sec
• Plastic package is flammability rated V-0 per Underwriters Laboratories
• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
• Matte tin lead–free Plated
• Available in breakdown Voltage from 6.8V to 180V specially designed for automotive applications
• Offers high-surge rating in compact package: bridges the gap between 600W and 1.5KW
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01)
Applications
TVS devices are ideal for the protection of I/O Interfaces, CVCoCmbpuustaenr,dInodtuhsetrrivaul lannedraCbolencsiurcmueitrseulescetdroinniTcelecom, applications.
Additional Infomarion
.