MMIC Amplifier. AWB688 Datasheet

AWB688 Amplifier. Datasheet pdf. Equivalent

Part AWB688
Description Wideband MMIC Amplifier
Feature AWB688 DC ~ 1500 MHz Wideband MMIC Amplifier Features  DC ~ 1200 MHz, 50  Application  For 30 ~ .
Manufacture ASB
Datasheet
Download AWB688 Datasheet



AWB688
AWB688
DC ~ 1500 MHz Wideband MMIC Amplifier
Features
DC ~ 1200 MHz, 50 Application
For 30 ~ 860 MHz 50 Matching @ Vdevice = +10 V, Idd = 300 mA:
22.8 dB Gain at 500 MHz
30 dBm OP1dB
45.5 dBm Output IP3
2.2 dB NF
AWB688
Package Style: SOIC8
Typical Performance
(Supply Voltage = +10 V, TA = +25 C, Z0 = 50 )
Parameters
Units
Typical
Frequency
MHz
30
50
500
Gain
dB 22.2 22.5 22.8
S11 dB -12 -13 -20
S22
Output IP31)
dB
dBm
-10
47.0
-11
47.5
-17
45.5
Noise Figure dB 1.7 1.8 2.2
Output P1dB
dBm
27.0
29.0
30.0
Current
mA 300 300 300
Device Voltage
V
+10
+10
+10
1) OIP3 is measured with two tones at an output power of +15 dBm/tone separated by 1 MHz.
Product Specifications
Parameters
Testing Frequency
Gain
S11
S22
Output IP3
Noise Figure
Output P1dB
Current
Device Voltage
Units
MHz
dB
dB
dB
dBm
dB
dBm
mA
V
Min Typ.
500
22.8
-20
-17
45.5
2.2
30.0
300
+10
860
22.5
-10
-10
45.0
2.1
30.5
300
+10
Max
Absolute Maximum Ratings
Parameters
Operating Case Temperature
Storage Temperature
Device Voltage
Operating Junction Temperature
Input RF Power (Continuous)
Thermal Resistance
Rating
-40 to 85 C
-40 to 150 C
+13 V
+150 C
+22 dBm
+14 C/W
* Please find the max. input power data from http://www.asb.co.kr/pdf/Maximum_Input_Power_Analysis.pdf
Applications
Wide Band
(30 ~ 860 MHz, 10 V, 300 mA)
Wide Band
(30 ~ 860 MHz, 12 V, 291 mA)
IF
(200 ~ 400 MHz, 10 V, 320 mA)
IF
(0.3 ~ 30 MHz, 9 V, 160 mA)
IF
(20 ~ 1000 MHz, 11 V, 283 mA)
Pin Configuration
Pin No. Function
1,3,5,6,8 NC or GND
2 RF IN
7 RF OUT
4
Current
Adjustable
1/9
ASB Inc. sales@asb.co.kr Tel: +82-42-528-7225
January 2014



AWB688
Outline Drawing
AWB688
DC ~ 1500 MHz Wideband MMIC Amplifier
Part No.
Symbols
Dimensions (In mm)
MIN NOM
MAX
A 1.40 1.50 1.60
A1 0.00 ---
0.10
A2 ---
1.45 ---
B
0.33 ---
0.51
C
0.19 ---
0.25
D
4.80 ---
5.00
D2 3.20 3.30 3.40
E 5.80 6.00 6.20
E1 3.80 3.90 4.00
E2 2.30 2.40 2.50
e --- 1.27 ---
L
0.40 ---
1.27
y
|L1-L1’|
L1
---
0
---
1.04REF
---
---
---
0.10
8
0.12
Pin No.
1
2
3
4
Function
NC or GND
RF IN
NC or GND
Current
Adjustable
Pin No.
5
6
7
8
Function.
NC or GND
NC or GND
RF OUT
NC or GND
Note: 1. Backside metal paddle is RF and DC ground.
Mounting Recommendation (In mm)
Note: 1. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
2. To ensure reliable operation, device ground paddle-to-ground
pad soldering is critical.
3. Add mounting screws near the part to fasten the board to a heat
sinker. Ensure that the ground / thermal via region contacts the
heat sinker.
4. A proper heat dissipation path underneath the area of the PCB
for the mounted device is strictly required for proper thermal op-
eration. Damage to the device can result from inappropriate heat
dissipation.
ESD Classification
HBM
Class 1B
Voltage Level: 500 V~1000 V
MM Class A
Voltage Level: <200 V
CAUTION: ESD-sensitive device!
Moisture Sensitivity Level (MSL)
Level 3 at 260C reflow
2/9 ASB Inc. sales@asb.co.kr Tel: +82-42-528-7225
January 2014





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