Surface mount zener diode
BZT52C2V0 - BZT52C51
Surface mount zener diode
FEATURES
z Planar die construction. z 500mW power dissipation on ceramic...
Description
BZT52C2V0 - BZT52C51
Surface mount zener diode
FEATURES
z Planar die construction. z 500mW power dissipation on ceramic
PCB. z General purpose, medium current.
z Ideally suited for automated assembly processes.
Pb
Lead-free
APPLICATIONS
z Zener diode. z Ultra-small surface mount package.
ORDERING INFORMATION
SOD-123
Type No.
Marking
Package Code
BZT52C2V4-BZT52C51
See table 2
SOD-123
MAXIMUM RATING @ Ta=25℃ unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ IF=10mA
Power Dissipation
Thermal resistance,junction to ambient air
VF Pd RθjA
0.9 500 305
V mW ℃/W
Junction temperature
Tj 150
℃
Storage temperature range
Tstg -65-150
℃
Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2
2. Short duration test pulse used to minimize self-heating effect.
3. When provided, otherwise, parts are provided with date code only, and type number
identifications appears on reel only.
4. f = 1KHz
MDD ELECTRONIC
201207
Surface mount zener diode
BZT52C2V0-BZT52C51
ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
Type Number
BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16 BZT52C18 BZT52C20 BZT52C22 BZT52C24 BZT52C27 BZT52C30 BZT52C33 BZT52C36 BZT52C39 BZT52C43 BZT52C47 BZT52C51
Marking Code
WY WX W1 W2 W3 W4 W5 W6 W7 W8 W9 WA...
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