No. | Part # | Manufacturer | Description | Datasheet |
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Pan Jit International Inc. |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil |
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Pan Jit International Inc. |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil |
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Pan Jit International Inc. |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil |
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Pan Jit International Inc. |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil |
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Pan Jit International Inc. |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 5.0µA above 11V • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • High temperature soldering : 260°C /10 seconds at terminals |
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Pan Jit International Inc. |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil |
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Pan Jit International Inc. |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil |
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PAN JIT |
SCHOTTKY BARRIER RECTIFIERS • Plastic package has Underwriters Laboratory Flammability Classification 94V-O utilizing Flame Retardant Epoxy Molding Compound. • For use in low voltage,high frequency inverters ,free wheeling ,and polarity protection applications . • Lead free in |
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PAN JIT |
SILICON ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA • Case: Molded Glass DO-35 • Terminals: Solderable per MIL-STD-750, Met |
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PAN JIT |
PLASTIC SILICON RECTIFIER • Plastic package has Underwriters Laboratories Flammability Classification 94V-O utilizing Flame Retardant Epoxy Molding Compound. • Low leakage. • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA • Case: |
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PAN JIT |
SILICON ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA • Case: Molded Glass DO-35 • Terminals: Solderable per MIL-STD-750, Met |
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PAN JIT |
SILICON ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA • Case: Molded Glass DO-35 • Terminals: Solderable per MIL-STD-750, Met |
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PAN JIT |
SILICON ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA • Case: Molded Glass DO-35 • Terminals: Solderable per MIL-STD-750, Met |
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PAN JIT |
SILICON ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA • Case: Molded Glass DO-35 • Terminals: Solderable per MIL-STD-750, Met |
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PAN JIT |
SILICON ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA • Case: Molded Glass DO-35 • Terminals: Solderable per MIL-STD-750, Met |
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PAN JIT |
SILICON ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA • Case: Molded Glass DO-35 • Terminals: Solderable per MIL-STD-750, Met |
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PAN JIT |
SILICON ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA • Case: Molded Glass DO-35 • Terminals: Solderable per MIL-STD-750, Met |
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PAN JIT |
SILICON ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA • Case: Molded Glass DO-35 • Terminals: Solderable per MIL-STD-750, Met |
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PAN JIT |
SILICON ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA • Case: Molded Glass DO-35 • Terminals: Solderable per MIL-STD-750, Met |
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PAN JIT |
SILICON ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA • Case: Molded Glass DO-35 • Terminals: Solderable per MIL-STD-750, Met |
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