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Part Number
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HYE18L128160BF-75 |
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Manufacturer
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Infineon |
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Title
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DRAMs for Mobile Applications |
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Description
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Infineon Specialty DRAMs
Mobile-RAM
w w w. i n f i n e o n . c o m / m e m o r y / Mo b i l e - R A M
Never stop thinking.
Mobile-RAM – Extende...
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Features
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M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improv...
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File Size
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569.46KB |
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Datasheet
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HYE18L128160BF-75 PDF File
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