| Part Number | MA4BPS101 |
| Manufacturer | Tyco |
| Title | PIN Diode Chips with Offset Bond Pads |
| Description | These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process. They contain a single shunt silicon PIN diode embedded... |
| Features |
• • • • • Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires Rugged Silicon-Glass Construction Silicon Nitride Passivation Polyimide Scratch Protection Chip Layout Description These silicon - glass PIN diode chips ar... |
| Published | Apr 27, 2005 |
| Datasheet |
 MA4BPS101 PDF File
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