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Part Number
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THGBM4G6D2HBAIR |
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Manufacturer
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Toshiba |
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Description
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8GB e-MMC Module |
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Published
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Jun 21, 2016 |
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Detailed Description
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Preliminary THGBM4G6D2HBAIR
8GB THGBM4G6D2HBAIR
TOSHIBA e-MMC Module
INTRODUCTION
THGBM4G6D2HBAIR is 8-GByte density...
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Datasheet
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THGBM4G6D2HBAIR
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Overview
Preliminary THGBM4G6D2HBAIR
8GB THGBM4G6D2HBAIR
TOSHIBA e-MMC Module
INTRODUCTION
THGBM4G6D2HBAIR is 8-GByte density of e-MMC Module product housed in 153 ball BGA package.
This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi Chip Module.
THGBM4G6D2HBAIR has an industry standard MMC protocol for easy use.
FEATURES THGBM4G6D2HBAIR Interface
THGBM4G6D2HBAIR has the JEDEC/MMCA Version 4.
41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Ball / Signal Allocation
P-VFBGA153-1113-0.
50-002FP(A) (11.
5 x 13mm, H1.
0mm max.
package)
14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
12 NC NC NC NC NC NC...
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