Part Number
|
MASW-009276-000DIE |
Manufacturer
|
MA-COM |
Description
|
Bumped GaAs SP3T Switch |
Published
|
Sep 29, 2016 |
Detailed Description
|
MASW-009276-000DIE
Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz
Rev. V2
Features
• 802.11b/g and Bluetooth Applicat...
|
Datasheet
|
MASW-009276-000DIE
|
Overview
MASW-009276-000DIE
Bumped GaAs SP3T Switch for WLAN 1.
0 - 4.
0 GHz
Rev.
V2
Features
• 802.
11b/g and Bluetooth Applications • Low Insertion Loss:
0.
5 dB 2.
4 GHz to 2.
5 GHz band • High Isolation: 32 dB Typical on RX • Low Harmonics: -70 dBc @ 20 dBm • Flip-chip configuration • RoHS* Compliant
Description
The MASW-009276-000DIE is a bumped GaAs pHEMT MMIC SP3T switch.
Typical applications are WLAN (802.
11 b/g) and Bluetooth applications.
Die Bump Pad Layout (bump side up)
The MASW-009276-000DIE delivers high isolation, low insertion loss, and high linearity at 2.
4 - 2.
5 GHz.
This device is fabricated using a 0.
5 micron gate length GaAs pHEMT process.
The process features full passivation f...
Similar Datasheet