NEW PRODUCT
Features
• Epitaxial Planar Die Construction • Surface Mount Package Suited for Automated Assembly • Simplifies Circuit Design and Reduces Board Space • Lead Free/RoHS Compliant (Note 1) • "Green" Device (Note 2)
Mechanical Data
• Case: SOT-563 • Case Material: Molded Plastic, “Green” Molding Compound.
UL
Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020C • Terminals: Finish ⎯ Matte Tin Finish annealed over Copper
leadframe.
Solderable per MIL-STD-202, Method 208 • Marking Information: See Page 4 • Ordering Information: See Page 4 • Weight: 0.
005 grams (approximate)
Reference Q1 Q2
Device Type
NPN PNP
R1(Nom) 47kΩ 2.
2 kΩ
R2(Nom) 47kΩ 47kΩ...