¾ For surface mounted applications in order to optimize board space. ¾ Low profile package ¾ Glass passivated junction ¾ Low inductance ¾ Plastic package has Underwriters Laboratory Flammability ¾ Excellent clamping capability ¾ Fast response time: t...

Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)