US3ABF THRU US3MBF 3.
0 Amp.
Surface Mount Glass Passivated High Efficient Rectifiers Features * For surface mounted application * Low Profile Package * Glass Passivated Chip Junction * High Temp Soldering: 260℃ for 10seconds at Terminals * Superfast Recovery Times A C B DE G F DIM.
A B C D E F G SMBF INCHES MIN MAX 0.
201 0.
217 0.
138 0.
146 0.
165 0.
173 0.
075 0.
087 0.
043 0.
051 0.
007 0.
010 0.
031 0.
047 MM MIN MAX 5.
10 5.
50 3.
5 3.
7 4.
2 4.
4 1.
90 2.
20 1.
10 1.
30 0.
18 0.
26 0.
80 1.
20 Mechanical Data * Case: SMBF Molded plastic * Terminals: Solderable per MIL-STD-750, Method 2026 * Polarity: Indicated by cathode band Maximum Ratings and Electrical Characteristics (TA=25℃ unless...

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