MULTI-CHIP
TRANSISTORS
PNP Silicon
MMDT3906
FEATURES
ULTRA-SMALL SURFACE MOUNT PACKAGE EPITAXIAL PLANAR DIE CONSTRUCTION IDEAL FOR LOW POWER AMPLIFICATION
AND SWITCHING ALSO AVAILABLE IN LEAD FREE VERSION PB FREE PRODUCT ARE AVAILABLE :98.
5% SN ABOVE
CAN MEET ROHSENVIRONMENT SUBSTANCE DIRECTIVE REQUEST
MECHANICAL DATA
CASE：SOT-363 TERMINALS：SOLDERABLE PER MIL-STD-202G,
METHOD 208 APPROX.
WEIGHT:0.
006 GRAM Halogen Free:MMDT3906-H
.
CASE：SOT-363
DIMENSIONS IN MILLIMETERS AND (INCHES)
MAXIMUM RATINGS
RATINGS AT 25°C AMBIENT TEMPERATURE UNLESS OTHERWISE SPECIFIED.
PATING
SYMBOL
COLLECTOR − EMITTER VOLTAGE
VCEO
COLLECTOR − BASE VOLTAGE EMITTER − BASE VOLTAGE COLLECTOR ...